Epoxy/silicone hybrid resin composition and optical semiconductor device
An epoxy/silicone hybrid resin composition is provided comprising (A) an organosilicon compound having at least one silicon-bonded hydroxyl group, (B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or all of the hydrogen atoms of the reactive hydroxyl groups are substituted by monovalent hydrocarbon groups or silyl groups, and (C) an aluminum base curing catalyst. The compatibility between silicone and epoxy resins is improved without a need for compatibilizing agent.
1. An epoxy/silicone hybrid resin composition comprising
(A) an organosilicon compound having at least one silicon-bonded hydroxyl group per molecule,
(B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or all of the hydrogen atoms of the reactive hydroxyl groups are substituted by substituted or unsubstituted monovalent hydrocarbon groups or silyl groups, and
(C) an aluminum base curing catalyst.
2. The epoxy/silicone hybrid resin composition of claim 1 , wherein the modified epoxy resin (B) has the general formula (1):
wherein R is hydrogen, a substituted or unsubstituted monovalent hydrocarbon group, glycidyl group, (meth)acrylic group or silyl group, and p is an integer of at least 1, with the proviso that a number “p” of R's may be the same or different when p is equal to or more than 2, and at least one of a number “p” of R's is a monovalent hydrocarbon group or silyl group.
3. The epoxy/silicone hybrid resin composition of claim 1 , wherein component (A) is (A′) an organosilicon compound having at least one group containing a multiple bond capable of participating in hydrosilylation reaction and at least one silicon-bonded hydroxyl group per molecule, and
said composition further comprising
(D) an organohydrogenpolysiloxane and
(E) a platinum group metal-based catalyst.
4. The epoxy/silicone hybrid resin composition of claim 1 , which is used for the encapsulation of optical semiconductor members.
5. An optical semiconductor device in which an optical semiconductor member is encapsulated with a transparent cured product of the epoxy/silicone hybrid resin composition comprising:
(A) an organosilicon compound having at least one silicon-bonded hydroxyl group per molecule.
(B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or all of the hydrogen atoms of the reactive hydroxyl groups are substituted by substituted or unsubstituted monovalent hydrocarbon groups or silyl groups, and
(C) an aluminum base curing catalyst.
6. The optical semiconductor device of claim 5 , which is a light-emitting semiconductor device in which a light-emitting semiconductor member is encapsulated with the cured product.