Semiconductor device
A semiconductor device is equipped with a semiconductor sensor chip for detecting pressure variations that is arranged inside of a hollow cavity of a housing, wherein an opening is formed in a prescribed region of the housing, which is not positioned opposite to the semiconductor sensor chip, so as to allow the hollow cavity to communicate with an external space. The opening is formed using at least one through-hole having a thin slit-like shape. Alternatively, the opening is formed using plural through-holes each having a desired shape such as a thin slit-like shape, a circular shape, and a sectorial shape. Thus, it is possible to reduce negative influences due to environmental factors such as dust and sunlight with respect to the semiconductor sensor chip.
1. A semiconductor device comprising:
a semiconductor sensor chip for detecting variations in pressure;
a housing having a cavity, within which the semiconductor sensor chip is disposed; and
a plurality of through-holes which are collectively formed in a prescribed region of the housing, said region being disposed at a position other than opposite to the semiconductor sensor chip, wherein the through-holes allow pressure variations external to the cavity to be transmitted to the semiconductor sensor chip.
2. A semiconductor device according to claim 1 , wherein each
through-hole has a thin slit-like shape.
3. A semiconductor device according to claim 2 , wherein the through-holes are parallel to each other.
4. A semiconductor device according to claim 2 , wherein a length of each of the through-holes is larger than three times a width of the through-hole.
5. A semiconductor device according to claim 2 , wherein a width of each of the through-holes is 0.3 mm or less.
6. A semiconductor device according to claim 1 , wherein the housing has at least a top and bottom, the semiconductor sensor chip being disposed on the bottom of the housing.
7. A semiconductor device according to claim 6 , wherein the plurality of through-holes are formed in the top of the housing.
8. A semiconductor device comprising:
a semiconductor sensor chip for detecting variations in pressure;
a substrate having a chip mount surface for mounting the semiconductor sensor chip; and
a cover member which in combination with the substrate forms a cavity within which the semiconductor sensor chip is disposed, wherein at least a prescribed part of the cover member is composed of a porous material so that pressure variations external to the cavity are transmitted to the semiconductor sensor chip.
9. A semiconductor device comprising:
a semiconductor sensor chip for detecting variations in pressure;
a housing having a cavity within which the semiconductor sensor chip is disposed; and
a plurality of through-holes formed in the housing so that pressure variations external to the cavity are transmitted to the semiconductor sensor chip, each through-hole being positioned in the housing such that a line extending through an axis of the through-hole does not intersect the semiconductor sensor chip.
10. A semiconductor device according to claim 9 , wherein the housing has at least a top and bottom, the semiconductor sensor chip being disposed on the bottom of the housing.
11. A semiconductor device according to claim 10 , wherein the plurality of through-holes are formed in the top of the housing.