IP Library › Granted Patent US 7,616,018
Granted Patent B2
US 7,616,018 · App. 12/046,818 · Granted Nov 10, 2009

Integrated circuit probing apparatus having a temperature-adjusting mechanism

Assignee: Star Technologies Inc.
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Quick Facts
Patent No.
US 7,616,018
App. No.
12/046,818
Granted
Nov 10, 2009
Kind
B2
Abstract

A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

Claims (10)

1. An integrated circuit probing apparatus, comprising:

a circuit board having a plurality of laminates;

at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit device facing a first surface of the circuit board;

a holder configured to support the circuit board; and

a temperature-adjusting mechanism positioned in one of the laminates,

wherein the temperature-adjusting mechanism is disposed inside the circuit board,

wherein the temperature-adjusting mechanism includes at least one flow line having at least one fluid inlet and a plurality of fluid outlets.

2. The integrated circuit probing apparatus of claim 1 , wherein the fluid inlet is positioned on a second surface of the circuit board.

3. The integrated circuit probing apparatus of claim 1 , wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof.

4. The integrated circuit probing apparatus of claim 1 , wherein the flow line is a guiding tube.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2024
From: STAR TECHNOLOGIES, INC.
To: VUETTE PTE. LTD.
Reel/Frame 066561/0434 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2008
From: LOU, CHOON LEONG; WANG, LI MIN
To: STAR TECHNOLOGIES INC.
Reel/Frame 020640/0865 →
Continuity (2)
Division 1160955800 · Dec 12, 2006
Related Publication 20080150567A1 · Jun 26, 2008