IP Library Granted Patent US 7,622,779
Granted Patent B2
US 7,622,779 · App. 10/526,523 · Granted Nov 24, 2009

Interconnection architecture and method of assessing interconnection architecture

Assignee: The Regents of the University of California
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Quick Facts
Patent No.
US 7,622,779
App. No.
10/526,523
Granted
Nov 24, 2009
Kind
B2
Abstract

A multi-celled chip. The chip includes a plurality of hexagonal cells arranged in an array. A plurality of interconnects including Y's connect the cells in clusters of three cells each, so that each of the cells is interconnected.

Claims (34)

1. A chip comprising:

an array of hexagonal cells;

a plurality of interconnects including a plurality of Y's, each of the Y's respectively connecting the cells in clusters of three cells each, wherein the cells within the clusters are interconnected;

wherein the Y connecting each cluster has a node and three interconnects, each of the three interconnects having an end that connects the node to a respective one of the cells within a cluster;

wherein each Y connects each cell of its respective cell group to the node.

2. A chip comprising:

an array of hexagonal cells;

a plurality of interconnects including a plurality of Y's, each of the Y's respectively connecting the cells in clusters of three cells each, wherein the cells within the clusters are interconnected;

wherein the Y connecting each cluster has a node and three interconnects connecting the node to respective ones of the cells within a cluster;

wherein each Y connects each cell of its respective cell group to the node;

wherein the plurality of interconnects are formed on a plurality of levels, wherein nodes of Y's connecting clusters of a lower level are interconnected by Y's of a higher level.

3. The chip of claim 2 wherein each of the Y's on a particular level is oriented in a direction that is rotated by 90° from the Y's on a next lower level and is rotated by 90° from the Y's on a next higher level.

4. The chip of claim 1 wherein the chip has a shape of a convex polygon having at least five sides.

5. The chip of claim 4 wherein the polygon is symmetrical to directions of the interconnect.

6. The chip of claim 1 wherein each of the clusters comprises three cells arranged and routed in three symmetrical directions.

7. The chip of claim 3 wherein all cells are interconnected to other cells.

8. A chip comprising:

an array of hexagonal cells;

a plurality of interconnects including a plurality of Y's, each of the Y's respectively connecting the cells in clusters of thee cells each, wherein the cells within the clusters are interconnected;

wherein each of the array of hexagonal cells includes a terminal for connecting to another cell;

wherein the Y connecting each cluster includes a node and three interconnects, each of the interconnects respectively connecting the node to a separate terminal in each of the thee cells within the cluster;

wherein each Y connects each cell of its respective cluster of thee cells to the node.

9. The chip of claim 1 wherein said array of hexagonal cells provides a hexagonal flow congestion pattern that does not include the center of the hexagonal pattern.

10. A chip comprising:

an array of hexagonal cells;

a plurality of interconnects including Y's connecting the cells in clusters of three adjacent cells each, wherein the cells in the clusters are interconnected; wherein the Y connecting each cluster has a node and three interconnects each of the interconnects having an end connecting the node to a respective one of the cells within a cluster;

wherein each Y connects each cell of its respective cell group to the node.

11. A chip comprising:

an array of hexagonal cells;

a plurality of interconnects including Y's connecting the cells in clusters of three adjacent cells each, wherein the cells in the clusters are interconnected;

wherein the Y connecting each cluster has a node and three interconnects connecting the node to respective ones of the cells within a cluster;

wherein each Y connects each cell of its respective cell group to the node;

wherein the plurality of interconnects are formed on a plurality of levels, wherein nodes of Y's connecting clusters of a lower level are interconnected by Y's of a higher level.

12. The chip of claim 11 wherein each of the Y's on a particular level is oriented in a direction that is rotated by 90° from the Y's on a next lower level and is rotated by 90° from the Y's on a next higher level.

Assignments (2)
CONFIRMATORY LICENSE Recorded Jun 16, 2010
From: UNIVERSITY OF CALIFORNIA, SAN DIEGO
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 024541/0948 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2005
From: CHENG, CHUNG-KUAN; CHEN, HONGYU; YAO, BO; GRAHAM, RONALD; CHENG, ESTHER Y.; ZHOU, FENG
To: REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE
Reel/Frame 017009/0965 →
Continuity (3)
Provisional Application 6041001100 · Sep 10, 2002
Provisional Application 6041039600 · Sep 11, 2002
Related Publication 20060049468A1 · Mar 9, 2006