Method of replenishing an oxidation suppressing element in a solder bath
View Patent ↗The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.
1. A soldering method comprising: preparing a solder bath having an initial composition prior to initial soldering using the solder bath and containing a first nonzero concentration of an oxidation suppressing element; performing a first soldering operation for a period of a plurality of days using the solder bath while replenishing the solder bath with a first replenishment solder alloy having the same composition as the initial composition of the solder bath to maintain the surface level of molten solder in the solder bath, the concentration of the oxidation suppressing element in the solder bath reaching a second concentration at the end of the period;
determining the average rate of decrease of the oxidation suppressing element in the solder bath during the first soldering operation over the period; and
performing a second soldering operation using the solder bath after the first soldering operation and starting when the concentration of the oxidation suppressing element in the solder bath is at the second concentration while replenishing the solder bath to maintain the surface level of molten solder in the solder bath with a second replenishment solder alloy having a third concentration of the oxidation suppressing element which is higher than the first concentration, the third concentration having a value such that the rate of supply of the oxidation suppressing element in the second replenishment solder alloy to the solder bath in the second soldering operation is greater than or equal to the determined average rate of decrease of the oxidation suppressing element in the solder bath during the first soldering operation.
2. A method as claimed in claim 1 wherein the third concentration is 2 to 6 times the first concentration.
3. A method as claimed in claim 1 wherein the third concentration is 60 to 100 ppm.
4. A method as claimed in claim 1 including performing the first soldering operation for approximately 1-2 weeks.
5. A method as claimed in claim 1 wherein the second replenishment solder alloy has the same composition as the initial composition of the solder bath except for the oxidation suppressing element.
6. A method as claimed in claim 1 wherein the second replenishment solder alloy has the same composition as the initial composition of the solder bath except for the oxidation suppressing element and copper.
7. A soldering method as claimed in claim 1 wherein the oxidation suppressing element is selected from P, Ge, Ga, and Ce.