Semiconductor device package

1. A semiconductor device package comprising:

at least one semiconductor device acting as a heating source;

a package substrate having an upper surface on which the semiconductor device is mounted, the package substrate at least having a higher heat conductivity than that of the semiconductor device; and

a fiber-reinforced polymer composite formed to surround a side surface of the package substrate, the polymer composite including fibers acting as a reinforcing material and a resin mass embedding the fibers therein,

wherein the fibers included in the fiber-reinforced polymer composite are wound along the side surface of the package substrate.

2. The package according to claim 1 , wherein the fibers included in the fiber-reinforced polymer composite correspond to 30%-80% of the total volume of the composite.

3. The package according to claim 1 , wherein the fibers are carbon, graphite, or glass fibers.

4. The package according to claim 1 , wherein the resin mass is composed of an epoxy resin, silicon resin, polyester resin, or vinyl-ester resin.

5. The package according to claim 1 , wherein the fibers are wound obliquely to have a predetermined inclination angle on the basis of the upper surface or lower surface of the package substrate.

6. The package according to claim 1 , wherein the semiconductor device is a light emitting diode chip, or laser diode chip.

7. The package according to claim 1 , wherein the package substrate is a semiconductor substrate, ceramic substrate, or metal substrate.