IP Library › Granted Patent US 7,629,730
Granted Patent B2
US 7,629,730 · App. 11/826,857 · Granted Dec 8, 2009

Piezoelectric electroacoustic transducing device

Assignee: Hosiden Corporation
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Quick Facts
Patent No.
US 7,629,730
App. No.
11/826,857
Granted
Dec 8, 2009
Kind
B2
Abstract

In order to simultaneously realize both improvements of the acoustic performance of a bimorph piezoelectric electroacoustic transducing device and the productivity, in a bimorph piezoelectric vibrator 10 in which a disk-like first piezoelectric element 12 is bonded to a first principal surface 11 a of a metal plate 11 , and a disk-like second piezoelectric element 13 is bonded to a second principal surface 11 b of the metal plate 11 , the diameter R 1 of the first piezoelectric element 12 is different from the diameter R 2 of the second piezoelectric element 13 . Furthermore, the diameter R 2 of the second piezoelectric element 13 is made smaller than the diameter R 1 of the first disk-like piezoelectric element 12 , and a lead-wire soldering portion 14 is ensured on the second principal surface 11 b of the metal plate 11 which is in the periphery of the second piezoelectric element 13.

Claims (13)

1. A piezoelectric electroacoustic transducing devices comprising:

a piezoelectric vibrator including a metal plate having a first principal surface and a second principal surface, a disk-like first piezoelectric element bonded to said first principal surface, and a disk-like second piezoelectric element bonded to said second principal surface; and

a frame which holds said piezoelectric vibrator, said frame including a support member for supporting said metal plate, and including an opening providing access to said second principal surface, wherein:

a diameter of said first piezoelectric element is different from a corresponding diameter of said second piezoelectric element.

2. The piezoelectric electroacoustic transducing device according to claim 1 , wherein:

the diameter of said second piezoelectric element is smaller than the diameter of said first piezoelectric element; and

a lead-wire soldering portion is provided on said second principal surface of said metal plate which is located in said opening and in a periphery of said second piezoelectric element.

3. The piezoelectric electroacoustic transducing device according to claim 1 , wherein:

said support member is ring-like having an inner edge portion and an outer edge portion, said inner edge portion being bonded to said metal plate and said outer edge portion being bonded to said frame.

4. The piezoelectric electroacoustic transducing device according to claim 3 , wherein:

the diameter of said second piezoelectric element is smaller than the diameter of said first piezoelectric element.

5. The piezoelectric electroacoustic transducing device according to claim 4 , wherein:

a bonded length for said inner edge portion of said support member is provided in an outer side with respect to said lead-wire soldering portion on said second principal surface of said metal plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2007
From: FUJIWARA, SATORU; NAGATA, YUKA
To: HOSIDEN CORPORATION
Reel/Frame 019604/0632 →
Priority Claims (1)
JP 2006-197650 · Jul 20, 2006 · national
Continuity (1)
Related Publication 20080018203A1 · Jan 24, 2008