Laser removal of layer or coating from a substrate
A method for treating a substrate having a layer or coating of material thereon (such as for example a metal conductor coated with an insulating ‘enamel’) comprises the steps of directing a pulsed beam of laser radiation at the substrate to cause an interaction or adjacent the interface between the layer or coating and the substrate, leading to local separation of the layer or coating. The removal is effected by creating an interaction effect at the interface between the substrate and the layer or coating to create an effect similar to a shockwave which causes local separation of the layer or coating at the interface.
1. A method of at least partially removing a layer or coating of material from a substrate, said method comprising the steps of:
directing at said substrate a pulsed beam of laser radiation of wavelength selected so that the coating or layer is substantially transparent to said laser radiation, thereby to cause a shockwave effect at or adjacent the interface between said layer or coating and said substrate to effect local separation of said layer or coating from said substrate.
2. A method according to claim 1 , wherein the coating or layer is substantially transparent to said laser radiation at its operating wavelength.
3. A method according to claim 1 , wherein the laser radiation is of wavelength of between 200 nm and 12 μm.
4. A method according to claim 3 , wherein said laser radiation is generated by an NdYag laser.
5. A method according to claim 1 , wherein said laser radiation is generated by CO 2 laser.
6. A method according to claim 1 , wherein said laser radiation is generated by a Q-switched laser.
7. A method according to claim 1 , wherein the pulsed beam has pulses of pulse length between 1 nanosecond and 300 nanoseconds.
8. A method according to claim 1 , wherein the pulse repetition rate of the pulsed beam is between 1 KHz and 30 KHz.
9. A method according to claim 1 , wherein the layer or coating includes a dielectric material.
10. A method according to claim 1 , wherein the substrate is a conductor of copper or copper based material.
11. A method according to claim 1 , wherein the layer or coating includes at least one metal oxide.
12. A method according to claim 1 , wherein said pulsed beam of radiation is effective also to etch or clean the surface of the substrate adjacent the interface.
13. A method according to claim 1 , wherein the pulsed beam of laser radiation is scanned relative to the substrate in a scan direction and at least one of the following parameters is controlled to cause removal of a moving swath of said layer or coating:
scan rate
peak power of the laser
pulse repetition rate of the laser
spot size.
14. A method according to claim 13 , wherein said pulsed beam of radiation is scanned over a selected region in a first scanning stage to effect initial removal of said layer or coating, and is then scanned over said region in a second scanning stage to effect cleaning of residual debris.
15. A method according to claim 1 , wherein said pulsed beam of laser radiation is scanned over said substrate along successive spaced scan lines.
16. A method of at least partially removing a layer of material from a substrate, said method comprising the steps of:
providing a substrate having a layer of material disposed thereon; and
subjecting the substrate with the layer of material thereon to a pulsed beam of laser radiation;
wherein parameters of the pulsed beam of laser radiation are selected so as to cause a shockwave effect at an interface between the substrate and the layer of material, thereby to achieve separation of the layer of material from the substrate.
17. The method of claim 16 , wherein the pulsed beam of laser radiation is selected so as to have a wavelength that results in the layer of material being substantially transparent to the laser radiation.
18. A method according to claim 16 , wherein the pulsed beam of laser radiation is scanned relative to the substrate in a scan direction, the parameters of the pulsed beam of laser radiation being controlled to cause removal of a moving swath of said layer or coating, said parameters comprising at least one of:
scan rate;
peak power of the laser;
pulse repetition rate of the laser; and
spot size.
19. A method according to claim 16 , wherein said pulsed beam of laser radiation is scanned over said substrate along successive spaced scan lines.
20. A method according to claim 18 , wherein said pulsed beam of radiation is scanned over a selected region in a first scanning stage to effect initial removal of said layer or coating, and is then scanned over said region in a second scanning stage to effect cleaning of residual debris.