Photoresist composition with antibacterial agent
View Patent ↗A photoresist composition, e.g., a positive acting resist, for use in the formation of circuit patterns and the like on printed circuit boards and the like circuitized substrates, the photoresist composition including a quantity of silver therein in a sufficient amount to substantially prevent bacteria formation within said composition. A method of making the composition is also provided.
1. A photoresist composition for use in the formation of circuit patterns on circuitized substrates, said photoresist composition including a quantity of silver therein in an amount of from about 100 parts per billion (PPB) of said composition to about 300 PPB of said composition to substantially prevent bacteria formation within said composition for a predetermined time period.
2. The photoresist composition of claim 1 wherein said quantity of silver is about 190 PPB of said composition.
3. The photoresist composition of claim 1 wherein said photoresist composition is a negative acting photoresist.
4. The photoresist composition of claim 1 wherein said photoresist composition is a positive acting photoresist.
5. The photoresist composition of claim 4 wherein said photoresist composition comprises, in addition to said quantity of silver, water, methyl n-hexyl ketone, triethanolamine, 1-methyl-2-pyrrolidinone, diazo photo-active compound, a dye compound, and an acrylic copolymer.
6. The photoresist composition of claim 5 wherein said water comprises less than about 70% of said composition, said methyl n-hexyl ketone comprises less than about 5% of said composition, said triethanolamine comprises less than about 1% of said composition, said 1-methyl-2-pyrrolidinone comprises less than about 3% of said composition, said diazo photo-active compound comprises less than about 5% of said composition, said dye compound comprises less than about 1% of said composition, and said acrylic copolymer comprises less than about 20% of said composition.
7. The photoresist composition of claim 5 wherein said quantity of silver is within the range of from about 100 PPB of said composition to about 300 PPB of said composition.
8. The photoresist composition of claim 7 wherein said quantity of silver is about 190 PPB of said composition.
9. A method of making a photoresist composition for use in the formation of circuit patterns on circuitized substrates, said method comprising:
providing a photoresist composition; and
periodically adding a quantity of silver to said photoresist composition in an amount of between about 100 PPB of said composition to about 300 PPB of said composition to substantially prevent bacteria formation within said composition for a predetermined time period.
10. The method of claim 9 wherein said photoresist composition is provided as a negative acting photoresist composition.
11. The method of claim 9 wherein said photoresist composition is provided as a positive acting photoresist composition.
12. The method of claim 9 wherein said quantity of silver is added to said photoresist composition so as to comprise about 190 PPB of said composition.
13. A method of making a circuitized substrate, said method comprising:
providing a substrate having a layer of conductor thereon;
providing a quantity of liquid photoresist composition;
adding a first quantity of silver to said liquid photoresist composition in a sufficient amount to substantially prevent bacteria formation within said liquid photoresist composition;
periodically adding a second quantity of silver as a function of bacteria growth;
depositing a layer of said liquid photoresist composition on said layer of conductor on said substrate;
heating said layer of liquid photoresist to substantially solidify said photoresist;
thereafter exposing said photoresist on said layer of conductor;
thereafter developing said photoresist on said layer of conductor to remove part of said photoresist and thereby expose selected areas of said layer of conductor;
thereafter etching said exposed areas of said layer of conductor to remove selected portions of said layer and define a circuit pattern on said substrate; and
thereafter removing the remaining portions of said photoresist from said substrate.
14. The method of claim 13 wherein said depositing of said layer of said liquid photoresist composition on said layer of conductor of said substrate is accomplished using electrodeposition.
15. The method of claim 13 wherein said quantity of silver is added to said liquid photoresist composition at an amount of from about 100 PPB to about 300 PPB.
16. The method of claim 15 wherein said quantity of silver is added to said liquid photoresist composition at an amount of about 190 PPB.
17. The method of claim 13 wherein said photoresist composition is provided within a tank having walls and said quantity of said silver is added to said photoresist composition while said photoresist composition is within said tank.
18. The method of claim 17 further including conditioning said walls of said tank prior to said providing of said photoresist composition within said tank.
19. The method of claim 18 wherein said conditioning comprises substantially filling said tank with a composition of water and silver and thereafter draining said tank.
20. The method of claim 19 wherein said silver in said composition of said water and silver comprises about 100 PPB of said composition of water and silver.
21. The method of claim 13 wherein said heating of said layer of liquid photoresist to substantially solidify said photoresist comprises positioning said substrate having said photoresist composition thereon within a convection oven.
22. The method of claim 13 wherein said exposing of said photoresist on said layer of conductor comprises exposing said photoresist to UV radiation.
23. The method of claim 13 wherein said developing of said photoresist on said layer of conductor to remove part of said photoresist and thereby expose selected areas of said layer of conductor comprises depositing a developer solution onto said photoresist.