IP Library Granted Patent US 7,645,823
Granted Patent B2
US 7,645,823 · App. 10/596,114 · Granted Jan 12, 2010

Resin composition, molded product from resin composition and method for preparing resin composition

Assignee: Sony Corporation
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Quick Facts
Patent No.
US 7,645,823
App. No.
10/596,114
Granted
Jan 12, 2010
Kind
B2
Abstract

Disclosed is a biodegradable resin composition containing at least one biodegradable organic high molecular compound, a flame retardant additive containing a phosphorus-containing compound, and a hydrolysis suppressing agent suppressing the hydrolysis of the at least one biodegradable organic high molecular compound. An aliphatic polyester resin is polylactic acid, polycaprolactone, polyhydroxy lactic acid, polyhydroxy valeric acid, polyethylene succinate, polybutylene succinate, polybutylene adipate, polymalic acid, polyesters synthesized by fermentation, or a copolymer containing at least one of them. A polysaccharide is cellulose, starch, chitin, chitosan, dextrane, a derivative of at least one of them, or a copolymer containing at least one of them.

Claims (79)

1. A resin composition comprising:

at least one biodegradable organic high molecular weight compound;

a flame retardant additive containing (1) a phosphorus-containing compound, (2) a hydroxide, and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound; and

a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition,

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

2. The resin composition according to claim 1 wherein said resin composition includes an organic high molecular weight compound that is an aliphatic polyester resin, a polysaccharide, a peptide, polyvinyl alcohol, a polyamide, a polyalkylene glycol or a copolymer containing at least one thereof.

3. The resin composition according to claim 2 wherein said aliphatic polyester resin is polylactic acid, polycaprolactone, polyhydroxy lactic acid, polyhydroxy valeric acid, polyethylene succinate, polybutylene succinate, polybutylene adipate, polymalic acid, polyester synthesized by fermentation or a copolymer containing at least one thereof.

4. The resin composition according to claim 2 wherein said polysaccharide is starch, chitin, chitosan, dextran, one of the derivatives of starch, or a copolymer containing at least one thereof.

5. The resin composition according to claim 1 wherein said hydroxide includes at least one metal hydroxide.

6. The resin composition according to claim 5 wherein said metal hydroxide is selected from the group consisting of at least one of aluminum hydroxide, magnesium hydroxide and calcium hydroxide.

7. The resin composition according to claim 1 wherein the average particle size of said hydroxide is 100 μm or less.

8. The resin composition according to claim 1 wherein the average particle size of said nitrogen compound is 100 μm or less.

9. The resin composition according to claim 1 wherein the phosphorus-containing compound is selected from the group consisting of at least one of the organic phosphorus compound and phosphorus.

10. The resin composition according to claim 1 wherein the hydrolysis suppressing agent is a carbodiimide compound, an isocyanate compound or an oxazoline compound.

11. A molded product obtained on molding a resin composition comprising:

at least one biodegradable organic high molecular weight compound;

a flame retardant additive containing a (1) phosphorus-containing compound, (2) a hydroxide and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound; and

a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition, and

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

12. An electrical product including, as a component element thereof, a molded product obtained on molding a resin composition comprising:

at least one biodegradable organic high molecular weight compound;

a flame retardant additive containing (1) a phosphorus-containing compound, (2) a hydroxide and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound; and

a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition, and

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

13. The electrical product according to claim 12 wherein said component element is a casing.

14. A method for fabrication of a resin composition comprising the step of:

combining (a) at least one biodegradable organic high molecular weight compound, (b) a flame retardant additive containing (1) a phosphorus-containing compound, (2) a hydroxide, and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound and (c) a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition, and

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

15. A resin composition comprising:

at least one biodegradable organic high molecular weight compound;

a flame retardant additive containing (1) a phosphorus-containing compound, (2) a hydroxide, and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound; and

a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition, and

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

16. The resin composition according to claim 15 wherein said resin composition includes an organic high molecular weight compound is an aliphatic polyester resin, a polysaccharide, a peptide, polyvinyl alcohol, a polyamide, a polyalkylene glycol or a copolymer containing at least one thereof.

17. The resin composition according to claim 16 wherein said aliphatic polyester resin is polylactic acid, polycaprolactone, polyhydroxy lactic acid, polyhydric valeric acid, polyethylene succinate, polybutylene succinate, polybutylene adipate, polymalic acid, polyester synthesized by fermentation or a copolymer containing at least one thereof.

18. The resin composition according to claim 15 wherein the average particle size of said hydroxide is 100 μm or less.

19. The resin composition according to claim 15 wherein said hydroxide includes at least one metal hydroxide.

20. The resin composition according to claim 19 wherein said metal hydroxide is selected from the group consisting of at least one of aluminum hydroxide, magnesium hydroxide and calcium hydroxide.

21. The resin composition according to claim 15 wherein the average particle size of said nitrogen compound is 100 μm or less.

22. The resin composition according to claim 15 wherein the hydrolysis suppressing agent is a carbodiimide compound, an isocyanate compound or an oxazoline compound.

23. A molded product obtained on molding a resin composition comprising:

at least one biodegradable organic high molecular weight compound;

a flame retardant additive containing (1) a phosphorus-containing compound, (2) a hydroxide and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound; and

a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition, and

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

24. An electrical product including, as a component element thereof, a molded product obtained on molding a resin composition comprising:

at least one biodegradable organic high molecular weight compound;

a flame retardant additive containing (1) a phosphorus-containing compound (2) a hydroxide and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound; and

a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition, and

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

25. The electrical product according to claim 24 wherein said component element is a casing.

26. A method for fabrication of a resin composition comprising the step of:

compounding at least one biodegradable organic high molecular weight compound, a flame retardant additive containing (1) a phosphorus-containing compound, (2) a hydroxide and (3) a nitrogen oxide having the formula N x O y and selected from the group consisting of a non-metallic nitric acid compound and/or a non-metallic nitrous acid compound, and a hydrolysis suppressing agent suppressing hydrolysis of said at least one biodegradable organic high molecular weight compound,

wherein,

an amount of hydroxide is from 30 to 100 parts by weight to 100 parts by weight of the organic high molecular weight compound,

an amount of phosphorous in the phosphorus-containing compound is not more than 20 parts by weight to 100 parts by weight of the composition of the entire resin composition, and

at least one biodegradable organic high molecular weight compound is cellulose or a derivate thereof.

27. The resin composition according to claim 15 , wherein the hydroxide compound is 100 parts by weight of the biodegradable organic high molecular compound.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2016
From: SONY CORPORATION
To: LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
Reel/Frame 040733/0448 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2006
From: HORIE, TAKESHI; YAMADA, SHINICHIRO; FUJIHIRA, YUKO; MORI, HIROYUKI; NOGUCHI, TSUTOMU
To: SONY CORPORATION
Reel/Frame 017699/0355 →
Priority Claims (3)
JP P2003-403475 · Dec 2, 2003 · national
JP P2003-403476 · Dec 2, 2003 · national
JP P2003-403477 · Dec 2, 2003 · national
Continuity (1)
Related Publication 20070270527A1 · Nov 22, 2007