Method for producing a stop zone in a semiconductor body and semiconductor component having a stop zone
A method for producing a buried stop zone in a semiconductor body and a semiconductor component having a stop zone, has the method steps of: providing a semiconductor body having a first and a second side and a basic doping of a first conduction type, irradiating the semiconductor body via one of the sides with protons, as a result of which protons are introduced into a first region of the semiconductor body situated at a distance from the irradiation side, carrying out a thermal process in which the semiconductor body is heated to a predetermined temperature for a predetermined time duration, the temperature and the duration being chosen such that hydrogen-induced donors are generated both in the first region and in a second region adjacent to the first region in the direction of the irradiation side.
1. A semiconductor component, comprising:
a semiconductor body having a first and second side,
an emitter zone arranged in the region one of the sides,
a stop zone of a first conduction type arranged at a distance from the emitter zone in a vertical direction of the semiconductor body,
an intermediate zone of the first conduction type arranged between the stop zone and the emitter zone,
a base zone of the first conduction type adjacent to the stop zone, said base zone being doped more weakly than the stop zone and the intermediate zone,
wherein
the doping concentration in the intermediate zone is greater than 5% of the maximum doping concentration in the stop zone and less than 50% of the maximum doping concentration in the stop zone.
2. The semiconductor component according to claim 1 , wherein the doping concentration of the intermediate zone is more than twice as high as the doping concentration in the base zone.
3. The semiconductor component according to claim 1 , wherein a distance between the stop zone and the one side is between 5% and 40% of the thickness of the semiconductor body.
4. The semiconductor component according to claim 3 , wherein a distance between the stop zone and the one side is between 10% and 15% of the thickness of the semiconductor body.
5. The semiconductor component according to claim 1 , wherein a dimensioning of the intermediate zone in a vertical direction of the semiconductor body is between 4% and 35% of the thickness of the semiconductor body.
6. The semiconductor component according to claim 1 , wherein the stop zone and the intermediate zone have hydrogen-induced donors.
7. The semiconductor component according to claim 1 , wherein the emitter zone is of the same conduction type as the stop zone and the intermediate zone.
8. The semiconductor component according to claim 1 , wherein the emitter zone is doped complementarily to the stop zone and the intermediate zone.