Film forming apparatus, substrate for forming oxide thin film and production method thereof
View Patent ↗The invention provides a film forming apparatus that is capable of forming films sequentially with two types of film forming mechanisms in the same chamber. The film forming apparatus according to the present invention includes a Pt target disposed at one side within a film forming chamber, a sputtering output mechanism to supply to the Pt target, a Pt vapor deposition source disposed at an other side within the film forming chamber, a vapor deposition output mechanism to supply to the Pt vapor deposition source, a substrate holder disposed between the Pt target and the Pt vapor deposition source within the film forming chamber to mount a substrate, a rotating mechanism to move the substrate holder so that the substrate directs to the Pt target or to the Pt vapor deposition source, a heating mechanism to heat the substrate when the substrate is subjected to a sputtering film forming, and a cooling mechanism to cool the substrate when the substrate is subjected to vapor deposition film forming.
1. A method of producing an oxide thin film forming substrate, comprising:
forming a first electrode thin film including at least one of Pt, Ir and Ru on a substrate disposed on a substrate holder at a substrate temperature ranging from room temperature to 650° C. by sputtering from a sputtering source in a chamber;
heating the substrate when the substrate is subjected to sputtering film forming;
forming a second electrode thin film including at least one of Pt, Ir and Ru on the first electrode thin film at substrate temperature not exceeding 350° C. by vapor deposition from a vapor deposition source within the chamber, the sputtering source and the vapor deposition source positioned such that one of the sources is above the substrate and the other of the sources is below the substrate;
rotating the substrate so that the substrate only faces one of the sources at a time in the chamber; and
cooling the substrate when the substrate is subjected to vapor deposition film forming,
wherein the step of rotating positions the substrate and the substrate holder such that the substrate holder provides line of sight visibility to only one of the deposition sources at a time.
2. A method of producing an oxide thin film forming substrate, comprising:
forming a first electrode thin film including at least one of Pt, Ir and Ru on a substrate disposed on a substrate holder at a substrate temperature ranging from room temperature to 650° C. by sputtering from a sputtering source;
heating the substrate when the substrate is subjected to sputtering film forming;
forming a second electrode thin film including at least one of Pt, Ir and Ru on the first electrode thin film at substrate temperature not exceeding 350° C. by vapor deposition from a vapor deposition source, the sputtering source and the vapor deposition source positioned such that one of the sources is above the substrate and the other of the sources is below the substrate;
cooling the substrate when the substrate is subjected to vapor deposition film forming; and
rotating the substrate to sequentially perform the step of forming the first electrode thin film and the step of forming the second electrode thin film and so that the substrate only faces one of the sources at a time in the chamber,
wherein the step of rotating positions the substrate and the substrate holder such that the substrate holder provides line of sight visibility to only one of the deposition sources at a time.
3. The method of claim 2 , wherein the step of rotating rotates the substrate in the plane of the substrate.