Semiconductor device and manufacturing method of the same
The on-resistance of a semiconductor device having a power transistor with a trench gate structure is reduced. A power MIS-FET with a trench gate structure is so formed that the relation expressed as 0≦b≦a holds, where a is the distance between an end of an interlayer insulating layer over the upper face of a semiconductor region for source and the end (position on the periphery of a trench) of the upper face of the semiconductor region for source farther from the gate electrode; and b is the length of the overlap between the interlayer insulating layer and the upper face of the semiconductor region for source. (b is the distance between the position of the end of the interlayer insulating layer over the upper face of the semiconductor region for source and position on the periphery of a trench). As a result, the area of contact between source pads and the semiconductor regions for source is increased, and further the distance between the source pads and a channel forming region can be shortened. Therefore, the on-resistance of the power MIS-FET with a trench gate structure can be reduced.
1. A semiconductor device having a field-effect transistor with a trench gate structure on a semiconductor substrate, the semiconductor substrate having a first main surface and a second main surface on the reverse side thereof,
the field-effect transistor with a trench gate structure comprising:
a source region of first conductivity type, provided on the first main surface of the semiconductor substrate;
a drain region of the first conductivity type, provided on the second main surface of the semiconductor substrate;
a channel forming region provided between the source region and the drain region of the semiconductor substrate;
a first trench that extends in a direction orthogonal to the first main surface of the semiconductor substrate so that the first trench extends from the first main surface of the semiconductor substrate, penetrates the source region and the channel forming region, and is terminated at the drain region;
a gate insulating layer formed in the first trench;
a gate electrode provided in the first trench via the gate insulating layer;
an interlayer insulating layer provided over the gate electrode; and
a source electrode that is provided over the first main surface of the semiconductor substrate with the interlayer insulating layer in-between, and is brought into contact with and electrically connected with the upper face of the source region, exposed from the interlayer insulating layer,
wherein the upper face of the gate electrode is formed at a level lower than the first main surface of the semiconductor substrate,
wherein the first main surface of the semiconductor substrate is formed with a second trench which extends in a direction orthogonal to the first main surface of the semiconductor substrate so that the second trench extends from the upper face of the source region, exposed from the interlayer insulating layer, wherein the second trench penetrates the source region, and is terminated at the channel forming region,
wherein, letting the distance, wherein the upper face of the source region is exposed from the interlayer insulating film, between an end of the interlayer insulating layer over the upper face of the source region and an edge of the second trench, adjacent to said end of the interlayer insulating layer, be “a” and letting the length of the overlap between the interlayer insulating layer and the upper face of the source region be “b”, b≦a,
wherein the source electrode is formed in the second trench; and
wherein the source electrode is brought into contact with and electrically connected with the source region and the channel forming region through the second trench.
2. The semiconductor device according to claim 1 ,
wherein the length b of the overlap between the interlayer insulating layer and the upper face of the source region is equal to or greater than 0.
3. The semiconductor device according to claim 1 ,
wherein an electrode is provided in the first trench via a first insulating layer,
wherein the gate electrode is formed above the electrode, and
wherein a second insulating layer is formed between the electrode and the gate electrode, and the electrode and the gate electrode are insulated from each other.
4. The semiconductor device according to claim 3 ,
wherein the electrode is electrically connected with source potential.
5. The semiconductor device according to claim 1 ,
wherein a plurality of the first trenches and a plurality of the gate electrodes are provided in the first main surface of the semiconductor substrate, and the adjoining pitch of adjoining gate electrodes is 1.0 μm or less.
6. The semiconductor device according to claim 1 ,
wherein the field-effect transistor with a trench gate structure is an n channel-type field-effect transistor.
7. A semiconductor device having a field-effect transistor with a trench gate structure on a semiconductor substrate, the semiconductor substrate having a first main surface and a second main surface on the reverse side thereof,
the field-effect transistor with a trench gate structure comprising:
a source region of first conductivity type, provided on the first main surface of the semiconductor substrate;
a drain region of the first conductivity type, provided on the second main surface of the semiconductor substrate;
a channel forming region provided between the source region and the drain region of the semiconductor substrate;
a first trench which extends in a direction orthogonal to the first main surface of the semiconductor substrate so that the first trench extends from the first main surface of the semiconductor substrate, penetrates the source region and the channel forming region, and is terminated at the drain region;
a gate insulating layer formed in the first trench;
a gate electrode provided in the first trench via the gate insulating layer;
an interlayer insulating layer that is provided over the gate electrode; and
a source electrode that is provided over the first main surface of the semiconductor substrate with the interlayer insulating layer in-between, and is brought into contact with and electrically connected with the upper face of the source region, exposed from the interlayer insulating layer,
wherein a cutoff trench is provided between an end of the source region on the periphery of a group of a plurality of cells of the field-effect transistor with a trench gate structure and an end of an insulating layer for isolation provided outside the end of the source region on the periphery of the group of a plurality of the cells,
wherein the first main surface of the semiconductor substrate is formed with a second trench which extends in a direction orthogonal to the first main surface of the semiconductor substrate so that the second trench extends from the upper face of the source region, exposed from the interlayer insulating layer, wherein the second trench penetrates the source region, and is terminated at the channel forming region,
wherein, letting the distance, wherein the upper face of the source region is exposed from the interlayer insulating film, between an end of the interlayer insulating layer over the upper face of the source region and an edge of the second trench, adjacent to said end of the interlayer insulating layer, be “a” and letting the length of the overlap between the interlayer insulating layer and the upper face of the source region be “b”, b≦a,
wherein the source electrode is formed in the second trench, and
wherein the source electrode is brought into contact with and electrically connected with the source region and the channel forming region through the second trench.
8. The semiconductor device according to claim 7 ,
wherein the cutoff trench is so provided that the cutoff trench intersects the first trench in the field-effect transistor with a trench gate structure.
9. The semiconductor device according to claim 7 ,
wherein the first trench in the field-effect transistor with a trench gate structure is so formed that the first trench extends in a first direction along the first main surface of the semiconductor substrate, and
wherein a plurality of the first trenches which extend in the first direction are disposed side by side in a second direction orthogonal to the first direction.
10. The semiconductor device according to claim 9 ,
wherein the cutoff trench is provided at both ends of a plurality of the first trenches in the first direction so that the cutoff trenches intersect the first trenches.
11. The semiconductor device according to claim 7 ,
wherein an electrode is provided in the first trenches via a first insulating layer,
wherein the gate electrode is formed above the electrode, and
wherein a second insulating layer is formed between the electrode and the gate electrode, and the electrode and the gate electrode are insulated from each other.
12. The semiconductor device according to claim 11 ,
wherein the electrode is electrically connected with source potential.
13. The semiconductor device according to claim 11 ,
wherein the first insulating layer is thicker than the gate insulating layer.
14. The semiconductor device according to claim 11 ,
wherein the first insulating layer and the insulating layer for isolation are comprised of an insulating layer formed in one and the same process.
15. The semiconductor device according to claim 1 ,
wherein a third insulating film is disposed between the interlayer insulating layer and the gate electrode.
16. The semiconductor device according to claim 11 ,
wherein a third insulating film is disposed between the interlayer insulating layer and the gate electrode.