Process for making an organic field effect transistor
The present invention relates to a process for reducing the mobility of an semiconductor (OSC) layer in an electronic device, which has a semiconducting channel area, in specific areas outside said channel area by applying an oxidzing agent to the OSC layer.
1. A process for preparing an organic electronic (OE) device comprising an organic semiconductor (OSC) layer which has a semiconducting channel area and a semiconducting area outside said semiconducting channel area, comprising the step of reducing the mobility of an organic semiconductor the (OSC) layer only in specific semiconducting areas outside said semiconducting channel area, by applying an oxidizing agent to the OSC layer in only said specific semiconducting areas of the OSC layer outside said semiconducting channel area.
2. A process according to claim 1 , wherein the oxidizing agent is a flux of plasma discharge.
3. A process according to claim 1 , wherein the oxidizing agent is an acid.
4. A process according to claim 1 , wherein the OSC layer is selectively protected by a protective patterned layer covering the areas wherein the mobility shall not be reduced.
5. A process according to claim 4 , wherein the OSC layer and the protective patterned layer are separated by an insulating layer.
6. A process according to claim 5 , wherein the insulating layer is a gate dielectric or an interlayer dielectric.
7. A process according to claim 4 , wherein the protective layer is an inorganic layer.
8. A process according to claim 7 , wherein the protective layer comprises a metal or metal oxide.
9. A process according to claim 4 , wherein the protective layer is an organic layer.
10. A process according to claim 9 , wherein the protective layer comprises a polymer, a photoresist or an organic ink.
11. A process according to claim 4 , wherein the protective layer comprises inorganic particles in an organic resin or ink.
12. A process according to claim 4 , wherein the protective layer is deposited by a printing technique.
13. A process according to claim 12 , wherein the protective layer is deposited by inkjet or microcontact printing.
14. A process according to claim 4 , wherein the protective layer is a functional component of the organic electronic device.
15. A process according to claim 1 , wherein the OSC layer comprises a polyacene and optionally an organic binder.
16. A process according to claim 1 , wherein the organic electronic device is an organic field effect transistor (OFET), thin film transistor (TFT), component of integrated circuitry (IC), radio frequency identification (RFTD) tag, organic light emitting diode (OLED), electroluminescent display, flat panel display, backlight, photodetector, sensor, logic circuit, memory element, capacitor, photovoltaic (PV) cell, charge injection layer, Schottky diode, planarising layer, antistatic film, conducting substrate or pattern, photoconductor, or electrophotographic element.
17. A process according to claim 1 , wherein the organic electronic device comprises a gate electrode that serves as a protective patterned layer.
18. A process according to claim 1 , wherein the organic electronic device is a TFT array for a display comprising a black mask that serves as a protective patterned layer.
19. A process according to claim 1 , wherein the organic electronic device is a top gate or bottom gate OFET device.