Semiconductor device and manufacturing method thereof
View Patent ↗An object of the present invention to provide a semiconductor device manufactured in short time by performing the step of forming the thin film transistor and the step of forming the photoelectric conversion layer in parallel, and to provide a manufacturing process thereof. According to the present invention, a semiconductor device is manufactured in such a way that a thin film transistor is formed over a first substrate, a photoelectric conversion element is formed over a second substrate, and the thin film transistor and the photoelectric conversion element are connected electrically by sandwiching a conductive layer between the first and second substrates opposed to each other so that the thin film transistor and the photoelectric conversion element are located between the first and second substrates. Thus, a method for manufacturing a semiconductor device which suppresses the increase in the number of steps and which increases the throughput can be provided.
1. A method of manufacturing a semiconductor device comprising:
forming a peeling layer over a first substrate;
forming a thin film transistor and a wiring, over the peeling layer;
forming a photoelectric conversion element including a photoelectric conversion layer between an anode electrode and a cathode electrode, and a terminal electrode electrically connected to the cathode electrode, over a second substrate;
pasting the first substrate and the second substrate which are opposed to each other through a conductive film by sandwiching the conductive film and a sealing material to make an electrical connection between the thin film transistor and the anode electrode and an electrical connection between the wiring and the terminal electrode so that the thin film transistor, the photoelectric conversion element, the wiring and the terminal electrode are located between the first and second substrates; and
peeling the first substrate from the thin film transistor while keeping the thin film transistor and the photoelectric conversion element held by the second substrate.
2. The method for manufacturing a semiconductor device according to claim 1 ,
wherein after peeling the first substrate, a third substrate is pasted to the thin film transistor.
3. The method for manufacturing a semiconductor device according to claim 2 ,
wherein the third substrate is a plastic substrate or a substrate formed with an organic resin material.
4. The method for manufacturing a semiconductor device according to claim 1 ,
wherein after peeling the first substrate, a third substrate is pasted to the thin film transistor.
5. The method for manufacturing a semiconductor device according to claim 4 ,
wherein the third substrate is a plastic substrate or a substrate formed with an organic resin material.
6. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the first substrate is a glass substrate or a quartz substrate.
7. The method for manufacturing a semiconductor device according to claim 1 ,
wherein a circuit comprising the thin film transistor amplifies an output of the photoelectric conversion element.