Strip socket for testing and burn-in having recessed portions with material that extends across a bottom surface of the corresponding semiconductor device
A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves assembling the semiconductor devices into a strip, isolating a portion of each of the semiconductor devices of the strip, and performing operations on the strip using a strip socket, wherein the strip socket is designed to make electrical contact substantially simultaneously with each semiconductor device in the strip.
1. A method of processing semiconductor devices, the method comprising:
assembling the semiconductor devices into a lead frame strip comprising a plurality of rows and columns of semiconductor devices;
electrically isolating a portion of each of the semiconductor devices of the lead frame strip;
aligning the lead frame strip and a strip socket by accepting the semiconductor devices by recessed portions of the strip socket, wherein each recessed portion is material that extends across a bottom surface of the corresponding semiconductor device; and
performing operations on the semiconductor devices in the lead frame strip using the strip socket, wherein the strip socket to make electrical contact substantially simultaneously with each semiconductor device in the lead frame strip.
2. The method of claim 1 , wherein the performing operations on the lead frame strip includes a final testing of the semiconductor devices.
3. The method of claim 2 , wherein the performing operations on the lead frame strip includes a burn-in of the semiconductor devices.
4. The method of claim 2 , wherein the final testing is handled by an automatic strip base test handler.
5. The method of claim 1 , wherein the isolating of a portion of each of the semiconductor device involves cutting a lead of each of the semiconductor devices.
6. The method of claim 1 , wherein the isolating a portion of each of the semiconductor devices involves isolating a terminal of each of the semiconductor devices.
7. The method of claim 1 , wherein the processing of the semiconductor devices is performed in a temperature range of −65° C. to 185° C.
8. The method of claim 1 , further comprising loading each of the semiconductor devices into the strip socket at substantially a same time.
9. The method of claim 1 , further comprising unloading each of the semiconductor devices from the strip socket at substantially a same time.
10. The method of claim 9 , further comprising:
forming leads of each of the semiconductor devices of the lead frame strip; and
singulating each of the semiconductor devices of the lead frame strip.
11. The method of claim 10 , further comprising packing the semiconductor devices.
12. The method of claim 1 , wherein the assembling the semiconductor devices comprises:
attaching the semiconductor devices to the lead frame strip;
wire bonding the semiconductor devices;
plating the semiconductor devices; and
molding the semiconductor devices.
13. A method of processing semiconductor devices, the method comprising:
assembling the semiconductor devices into a lead frame strip comprising a plurality of rows and columns of semiconductor devices;
electrically isolating a portion of each of the semiconductor devices of the lead frame strip;
aligning the lead frame strip and a strip socket by accepting the semiconductor devices by recessed portions of the strip socket, wherein each recessed portion is material that extends across a bottom surface of the corresponding semiconductor device; and
performing operations on the semiconductor devices in the lead frame strip using the strip socket mounted to a testing/burn-in board, wherein the strip socket to make electrical contact substantially simultaneously with each semiconductor device in the lead frame strip.