Integrated circuit, memory cell, memory module, method of operating an integrated circuit, and method of manufacturing a memory cell

1. An integrated circuit, comprising:

an arrangement of memory cells,

wherein each memory cell is connected to a programming current path used for programming the memory cell, and a sensing current path used for sensing a memory state of the memory cell,

wherein the programming current path and the sensing current path are at least partially separated from each other,

wherein the memory cells are thermal selectable magneto-resistive memory cells, or the memory cells are spin injection current switching selectable memory cells,

wherein each memory cell comprises a storage memory element and a sensing memory element that is spatially separated from the storage memory element,

wherein the programming current path runs through the storage memory element, and

wherein the sensing current path runs through the sensing memory element; and

a second conductive line disposed above a first conductive line or disposed above a conductive plate,

wherein one of the sensing memory element and the storage memory element is electrically connected between the first conductive line and the second conductive line, or is electrically connected between the conductive plate and the second conductive line, and

wherein the other one of the sensing memory element and the storage memory element is disposed below the first conductive line or the conductive plate, and is electrically connected to the first conductive line or the conductive plate.

2. The integrated circuit according to claim 1 , wherein a distance between the sensing memory element and the storage memory element belonging to the same memory cell is chosen such that a stray field caused by magnetization of the storage memory element causes the sensing memory element to adapt the same magnetization as that of the storage memory element.

3. The integrated circuit according to claim 2 , wherein a lateral distance between neighboring sensing memory elements and neighboring storage memory elements is chosen such that a stray field caused by the magnetization of the storage memory element does not change the magnetization of the neighboring sensing memory elements and the magnetization of the neighboring storage memory elements.

4. The integrated circuit according to claim 1 , wherein the conductive plate is a continuous plate that is shared between a plurality of memory cells.

5. The integrated circuit according to claim 1 , wherein the other one of the sensing memory element and the storage memory element is electrically connectable to a conductive element set to a fixed potential.

6. The integrated circuit according to claim 5 , wherein the conductive element set to a fixed potential is connected to the other one of the sensing memory element and the storage memory element by applying a voltage to a third conductive line.

7. The integrated circuit according to claim 5 , wherein the first conductive line or the conductive plate is a read/write bit line, the second conductive line is a read word line, and the third conductive line is a write word line.

8. The integrated circuit according to claim 1 , further comprising a heating barrier that is heated by a heating current and that is connected between the storage memory element and one of the first conductive line, the second conductive line, and the conductive plate, or comprising a spin torque barrier that is connected between the storage memory element and one of the first conductive line, the second conductive line, and the conductive plate.

9. The integrated circuit according to claim 8 , wherein a sensing barrier is connected between the sensing memory element and one of the first conductive line, the second conductive line, and the conductive plate.

10. The integrated circuit according to claim 9 , wherein the sensing barrier is optimized for a memory state sensing process, and the heating barrier is optimized for a memory cell heating process, and the spin torque barrier is optimized for a memory cell writing process.

11. The integrated circuit according to claim 10 , wherein a distance between the sensing memory element and the storage memory element belonging to the same memory cell is between 10 nm and 100 nm.

12. The integrated circuit according to claim 1 , wherein a pitch between neighboring memory cells is larger than the distance between the storage memory element and the sensing memory element belonging to the same memory cell.

13. The integrated circuit according to claim 12 , wherein the distance between the storage memory element and the sensing memory element of one memory cell is smaller than or equal to a lateral extent of the storage memory element.

14. A memory cell,

wherein the memory cell is connectable to a programming current path used for heating the memory cell, and a sensing current path used for sensing a memory state of the memory cell,

wherein the programming current path and the sensing current path are at least partially separated from each others,

wherein the memory cell comprises a storage memory element and a sensing memory element that is spatially separated from the storage memory element,

wherein the memory cell further comprises a second conductive line disposed above a first conductive line or disposed above a conductive plate,

wherein one of the sensing memory element and the storage memory element is electrically connected between the first conductive line and the second conductive line, or is electrically connected between the conductive plate and the second conductive line, and

wherein the other one of the sensing memory element and the storage memory element is disposed below the first conductive line or the conductive plate, and is electrically connected to the first conductive line or the conductive plate.

15. A memory module comprising at least one integrated circuit comprising an arrangement of memory cells,

wherein each memory cell is connected to a programming current path used for heating the memory cell, and a sensing current path used for sensing a memory state of the memory cell,

wherein the programming current path and the sensing current path are at least partially separated from each other,

wherein each memory cell comprises a storage memory element and a sensing memory element that is spatially separated from the storage memory element,

wherein the arrangement of memory cells further comprises a second conductive line disposed above a first conductive line or disposed above a conductive plate,

wherein one of the sensing memory element and the storage memory element is electrically connected between the first conductive line and the second conductive line, or is electrically connected between the conductive plate and the second conductive line, and

wherein the other one of the sensing memory element and the storage memory element is disposed below the first conductive line or the conductive plate, and is electrically connected to the first conductive line or the conductive plate.

16. The memory module according to claim 15 , wherein the memory module is stackable.

17. A method of operating an integrated circuit comprising an arrangement of thermal selectable magneto-resistive memory cells, the method comprising:

routing a programming current through a memory cell;

programming the memory cell using the programming current; and

routing a sensing current though the memory cell,

wherein a programming current path used for routing the programming current through the memory cell is at least partially different from a sensing current path used for routing the sensing current through the memory cell,

wherein the memory cell comprises a storage memory element and a sensing memory element that is spatially separated from the storage memory element,

wherein the memory cell comprises a second conductive line disposed above a first conductive line or disposed above a conductive plate,

wherein one of the sensing memory element and the storage memory element is electrically connected between the first conductive line and the second conductive line, or is electrically connected between the conductive plate and the second conductive line, and

wherein the other one of the sensing memory element and the storage memory element is disposed below the first conductive line or the conductive plate, and is electrically connected to the first conductive line or the conductive plate.

18. A method of manufacturing a memory cell, the method comprising:

providing a storage memory element;

providing a first conductive line or conductive plate above the storage memory element;

providing a second conductive line disposed above the first conductive line or disposed above the conductive plate; and

providing a sensing memory element;

wherein one of the sensing memory element and the storage memory element is electrically connected between the first conductive line and the second conductive line, or is electrically connected between the conductive plate and the second conductive line, and

wherein the other one of the sensing memory element and the storage memory element is disposed below the first conductive line or the conductive plate, and is electrically connected to the first conductive line or the conductive plate.

19. The method according to claim 18 , further comprising providing a select device.