Method and arrangement for producing a smart card
A method is provided for producing a smart card comprising a chip module with at least one contacting area, the chip module arrangeable in a mounting location of a substrate, wherein one contacting loop is formed from a wire connector fed by a wire guiding unit for at least one of the contacting areas, respectively by attaching a first section of the wire conductor to a surface of the substrate outside the mounting location, wherein a second section of the wire conductor proximate to the first section is guided to form the contacting loop along with and protruding from the surface, wherein a subsequent third section of the wire conductor is attached to the surface outside the mounting location, wherein the chip module is inserted into the mounting location and wherein the second section is bent over and electrically contacted to the contacting area.
1. A method for producing a smart card, the method comprising:
providing a chip module with at least one contacting area, the chip module being arrangeable in a mounting location of a substrate;
forming one contacting loop from a guided wire conductor for at least one of the contacting areas, respectively, by attaching a first section of the wire conductor to a surface of the substrate outside of the mounting location;
guiding a second section of the wire conductor that is proximate to the first section to form the contacting loop along with and protruding from the surface of the substrate;
attaching a subsequent third section of the wire conductor to the surface of the substrate outside of the mounting location;
inserting the chip module into the mounting location;
bending the second section over towards the contacting area;
electrically contacting the second section to the contacting area;
2. The method according to claim 1 , wherein the chip module has at least two contacting areas, and further comprising connecting at least two of the contacting areas to a respective contacting loop, wherein both contacting loops are part of the same wire connector that is formed as an antenna coil.
3. The method according to claim 2 , further comprising arranging the antenna coil around the mounting location.
4. The method according to claim 2 , further comprising arranging the antenna coil so that a portion of the antenna coil traverses the mounting location, and inserting the chip module on top of the portion of the antenna coil.
5. The method according to claim 1 , further comprising inserting the chip module before the step of forming the contacting loop.
6. The method according to claim 1 , further comprising inserting the chip module after the step of forming the contacting loop.
7. The method according to claim 1 , further comprising guiding the second section by lifting and sinking a wire guiding unit and varying a feed rate of the wire connector.
8. The method according to claim 1 , further comprising feeding the wire connector by a wire guiding unit integrated in an ultrasonic sonotrode and attaching the first section and the third section to the surface of the substrate by energy provided by the ultrasonic sonotrode, and wherein the substrate is a thermoplastic film.
9. The method according to claim 8 , further comprising attaching at least one additional film is attached to at least one of two surfaces of the substrate.
10. The method according to claim 9 , wherein the additional film has a recess for encasing the chip module.
11. The method according to claim 9 , wherein the additional film has a softening temperature that is lower than a softening temperature of the substrate.
12. The method according to claim 1 , further comprising guiding the second section such that a contacting loop is formed that protrudes substantially perpendicularly from the surface.
13. The method according to claim 1 , further comprising guiding the second section such that a contacting loop is formed that protrudes substantially 2 mm from the surface at most.
14. The method according to claim 1 , further comprising forming the mounting location as a recess in the substrate.
15. The method according to claim 1 , further comprising using an enamel-insulated copper wire as the wire connector.
16. The method according to claim 1 , further comprising electrically contacting the second section to the contacting area by thermal bonding, ultrasonic welding, soldering, laser soldering, laser welding, gluing, or crimping.
17. The method according to claim 1 , wherein the substrate is one of a multitude of segments of a multi-image board, and wherein the segments are processed sequentially.
18. The method according to claim 1 , characterized in that the substrate is one of a multitude of segments of a multi-image board, and wherein at least two of the segments are processed substantially simultaneously by respective wire guiding units.
19. The method according to claim 1 , further comprising guiding the second section around an auxiliary tool to form the shape of the contacting loop.
20. The method according to claim 19 , further comprising forming the contacting loop in an Omega-shape.
21. The method according to claim 2 , further comprising testing the antenna coil and inserting the chip module if the antenna coil passes the test.