Modular sample conditioning system
An on-stream sample collection and conditioning system, which is easier to construct, implement, maintain, and is more cost efficient then existing systems. The preferred embodiment of the present invention contemplates a modular system adaptable to a variety of diverse sample conditioning requirements. The system having incorporated a seamless piece having a surface for docking multiple sample conditioning components and having a system of internal passages to provide fluid flow between sample conditioning components. The preferred embodiment of the present invention also contemplates a modular system containing essentially the entire sample conditioning components required for one or more fluid streams.
1. A method of providing a sample fluid conditioning apparatus, comprising the steps of:
a. Establishing a fluid communication order of sample conditioning components to effect conditioning of said sample fluid;
b. Designing a system of fluid passages to fluidly interconnect said sample conditioning components;
c. Forming said fluid passages by forming grooves on a first surface of a first base plate;
d. Sealing said formed grooves in said first base plate to provide enclosed fluid passages by sealing a second plate over said grooves, forming a base module;
e. Providing fluid communication of said enclosed passages in said base module with the outer surface of said first plate via junction ports, said junction ports positioned so as to form a component docking surface;
f. Mounting said sample conditioning components to said component docking surface so as to communicate with said enclosed fluid passages in the fluid communication order of Step “A”;
g. Providing fluid communication of said enclosed passages in said base module with the outer surface of said second plate via junction ports, said junction ports positioned so as to form a second component docking surface; and
h. Mounting said sample conditioning components to said second component docking surface so as to communicate with said enclosed fluid passages in the fluid communication order of Step “A”.
2. The method of claim 1 , wherein there is further included the additional step “g” of providing a fluid connection between said base module and a second base module, each said base module containing multiple sample conditioning components.
3. The method of claim 2 , wherein said fluid connections are from the docking surface of a first base board module to a docking surface of said second base module.
4. The method of claim 1 , wherein said second plate is sealed over said grooves formed in said first plate by brazing.
5. The method of claim 4 , wherein the brazing is nickel brazing.
6. The method of claim 1 , wherein said second plate is sealed over said grooves formed in said first plate by adhesive bonding.
7. The method of claim 1 , wherein said second plate is sealed over said grooves formed in said first plate by fusion.
8. The method of claim 1 , wherein said second plate is sealed over said grooves formed in said first plate by solvent bonding.
9. The method of claim 1 , wherein said grooves are formed in said first plate by mechanical milling.
10. The method of claim 1 , wherein said grooves are formed by chemical etching.
11. The method of claim 1 , wherein said grooves are formed by laser etching.
12. The method of claim 1 , wherein said grooves are plated to resist chemical attack.
13. The method of claim 1 , wherein said grooves are plated to resist adsorption of sample fluid components.
14. The method of claim 1 , wherein said base module is constructed from three or more plates.
15. The method of claim 1 wherein said passages provide a conduit for electronic wiring or communication cable.
16. The method of claim 1 wherein said passages provides one or more passages for actuation fluid.
17. The method of claim 1 , wherein said base plates forming said first base board module are stacked upon one another.
18. The method of claim 1 , wherein in step “a” said docking surface is formed to have a mounting area for a modular conditioning component, and wherein in step “a” there is further provided the step of forming an access aperture in said mounting area, said access aperture formed to communicate with one or more of said passages formed in said base board module.
19. The method of claim 18 , wherein there is further provided in step “a” the step of forming a fluid containment groove formed in said mounting area about said access aperture so as to contain and divert fluid leakage from said access aperture.
20. The method of claim 19 , wherein in step “f” there is further provided the step of mounting a modular conditioning component to said docking surface at said mounting area so as to provide a mounted modular conditioning component, said mounted modular conditioning component engaging said access aperture, while enclosing said fluid containment groove to form a fluid containment passage to contain and divert any leakage from said access aperture.
21. The method of claim 20 , wherein in step “a” there is further provided the step of indicating the location of said mounting area via indicia, and in step “f” there is further provided the step of utilizing said indicia to position and mount said modular conditioning component.
22. The method of claim 21 , wherein said indicia indicates the type of modular sample component to be mounted thereon.
23. The method of claim 1 , wherein in step “d”, a gasket is juxtaposed between said first plate and said second plate to contain fluid in said grooves formed in said first plate.
24. The method of claim 23 , wherein in step “d” said first and second plates are mechanically engaged to one another via threaded fasteners so as to engage said gasket about said grooves.
25. The method of claim 1 , wherein in step “a” said docking surface is formed to have a mounting area for a manifold, and wherein in step “a” there is further provided the step of forming access apertures in said mounting area, said access apertures formed to communicate with one or more of said passages formed in said base board module.
26. The method of claim 25 , wherein there is provided the added steps of:
h. providing a manifold comprising a body having formed therethrough a series of passages, each of said passages having first and second ends, each of said first ends formed to engage a separate fluid line, said second ends of each of said passages positioned to align with predetermined said access apertures formed in said mounting area; and
I. mounting said manifold to said docking surface, so as to engage said second ends of said passages formed in said manifold in predetermined manner to said access apertures in said docking surface, providing fluid communication therebetween.