Dispensing device and mounting system
A dispensing device ( 4 ) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent ( 66, 67 ), a chamber ( 52 ) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser ( 73 ) provided in the chamber ( 52 ) and discharging underfill agent introduced from the storing means ( 66, 67 ) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means ( 46 ) for reducing the pressure in the chamber ( 52 ) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser ( 73 ). The dispensing device ( 4 ) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device ( 4 ) is also provided by the invention.
1. A dispensing device for charging underfill agent into a gap between a substrate and a chip comprising:
a storing unit for storing underfill agent;
a chamber provided for containing a substrate to be charged with underfill agent and capable of being opened/closed;
a dispenser provided in said chamber and discharging underfill agent introduced from said storing unit into said gap between said substrate and said chip;
a pressure reducing unit connected directly to said chamber by a first passage containing a valve, said first pressure reducing unit reducing a pressure in said chamber at a predetermined vacuum pressure to make underfill agent without bubbles, prior to said discharge of underfill agent by said dispenser; and
a tube between said storing unit and said dispenser, and
wherein said pressure reducing unit is connected directly to said tube by a second passage containing a valve, for reducing a pressure in said tube at a predetermined vacuum pressure prior to introduction of underfill agent from said storing unit to said dispenser through said tube;
wherein said storing unit comprises a first storing unit, a second storing unit and a three-way valve, and said first and second storing units are provided so as to be selectively communicated with said dispenser via said three-way valve; and
wherein said three-way valve includes a first mode, a second mode and a third mode so that said first storing unit only communicates with said dispenser in said first mode; said second storing unit only communicates with said dispenser in said second mode; and said first storing unit, said second storing unit and said dispenser are disconnected from each other in said third mode.
2. A mounting system comprising:
a chip mounting device for mounting a chip on a substrate and pressing said chip to said substrate;
a substrate loader for carrying said substrate into said chip mounting device;
a dispensing device for charging underfill agent into a gap between said substrate and said chip; and
a substrate unloader for carrying a substrate charged with underfill agent in said dispensing device out of said dispensing device;
wherein said dispensing device comprises
a storing unit for storing underfill agent;
a chamber provided for containing said substrate to be charged with underfill agent and capable of being opened/closed;
a dispenser provided in said chamber and discharging underfill agent introduced from said storing unit into said gap between said substrate and said chip;
a pressure reducing unit connected directly to said chamber by a first passage containing a valve, said first pressure reducing unit reducing a pressure in said chamber at a predetermined vacuum pressure to make underfill agent without bubbles, prior to said discharge of underfill agent by said dispenser;
a tube between said storing unit and said dispenser, and
wherein said pressure reducing unit is connected directly to said tube by a second passage containing a valve, for reducing a pressure in said tube at a predetermined vacuum pressure prior to introduction of underfill agent from said storing unit to said dispenser through said tube;
wherein said storing unit comprises a first storing unit, a second storing unit and a three-way valve, and said first and second storing units are provided so as to be selectively communicated with said dispenser via said three-way valve; and
wherein said three-way valve includes a first mode, a second mode and a third mode so that said first storing unit only communicates with said dispenser in said first mode; said second storing unit only communicates with said dispenser in said second mode; and said first storing unit, said second storing unit and said dispenser are disconnected from each other in said third mode.
3. The mounting system according to claim 2 , wherein each of said substrate loader and said substrate unloader has an oven capable of heat reserving said substrate together with a substrate magazine, each of said chip mounting device and said dispensing device has a stage for placing and holding said substrate thereon, and said stage has a heater for heat reserving said substrate at a predetermined temperature.