Transparent conductive multilayer body
A transparent conductive multilayer body of the present invention is characterized by having: a transparent film base; an SiO x film (x is no less than 1.5 and less than 2) which is provided on one surface of the above described film base in accordance with a dry process, and has a thickness of 1 nm to 30 nm and a relative index of refraction of 1.6 to 1.9; an SiO 2 film which is provided on the above described SiO x film and has a thickness of 10 nm to 50 nm; and a transparent conductive thin film which is provided on the above described SiO 2 film and has a thickness of 20 nm to 35 nm.
1. A transparent conductive multilayer body, characterized by comprising:
a transparent film base;
an SiO x film (x is no less than 1.5 and less than 2) which is provided on one surface of said film base in accordance with a dry process, and has a thickness of 1 nm to 30 nm and a relative index of refraction of 1.6 to 1.9;
an SiO 2 film which is provided in direct contact with said SiO x film and has a thickness of 10 nm to 50 nm; and
a transparent conductive thin film which is provided in direct contact with said SiO 2 film and has a thickness of 20 nm to 35 nm.
2. The transparent conductive multilayer body according to claim 1 , characterized in that
a resin layer is provided on at least one surface of said film base.
3. The transparent conductive multilayer body according to claim 1 , characterized in that
a transparent substrate is bonded to the surface on the opposite side of said film base with a transparent pressure-sensitive adhesive layer in between.
4. The transparent conductive layer body according to claim 1 , characterized in that
said conductive thin film is made of crystalline indium tin oxide having a crystal grain diameter of no greater than 200 nm and a crystal content which exceeds 50%.
5. The transparent conductive multilayer body according to claim 1 , characterized in that
the hardness on the side on which said conductive thin film is layered is no less than 2 GPa.
6. The transparent conductive multilayer body according to claim 1 , characterized in that
the modulus of elasticity on the side on which said conductive thin film is layered is no less than 8 GPa.
7. A touch panel, characterized by having the transparent conductive multilayer body according to claim 1 and a lower substrate placed to face each other with a spacer in between.