Method of making an ignition device
A method of manufacturing an ignition device is provided. The method includes patterning a plurality of resistors on a membrane to form heating elements and thermally isolating the heating elements from an external environment via a cavity disposed adjacent to the heating elements.
1. A method of manufacturing an ignition device, comprising:
patterning a plurality of resistors in or on a membrane to form heating elements; and
thermally isolating the heating elements from an external environment via a cavity sealed in a vacuum or in an inert environment and disposed immediately adjacent to the heating elements.
2. The method of claim 1 , wherein the membrane comprises a layer of un-doped silicon carbide.
3. The method of claim 1 , wherein patterning the the plurality of resistors comprises patterning doped silicon carbide material within the membrane.
4. The method of claim 1 , wherein patterning the plurality of resistors comprises forming contact pads for electrical connection within the membrane.
5. The method of claim 1 , wherein thermally isolating the heating elements comprises sealing the heating elements in vacuum, or in an inert environment.
6. The method of claim 1 , wherein the plurality of resistors are microscale resistors.
7. A method of manufacturing an ignition device, comprising:
patterning a plurality of resistors in or on a membrane to form heating elements;
thermally isolating the heating elements from an external environment via a cavity disposed immediately adjacent to the heating elements; and
sealing the cavity in a vacuum.
8. The method of claim 7 , wherein the membrane comprises a layer of un-doped silicon carbide.
9. The method of claim 7 , wherein patterning the plurality of resistors comprises patterning doped silicon carbide material within the membrane.
10. The method of claim 7 , wherein patterning the plurality of resistors comprises forming contact pads for electrical connection within the membrane.
11. The method of claim 7 , wherein thermally isolating the heating elements comprises sealing the heating elements in vacuum, or in an inert environment.
12. The method of claim 7 , wherein the plurality of resistors are microscale resistors.
13. The method of claim 7 , wherein sealing the cavity in a vacuum comprises bonding a silicon wafer adjacent to the cavity.
14. The method of claim 7 , wherein sealing the cavity in a vacuum comprises bonding a silicon carbide or a platinum coated wafer adjacent to the cavity.
15. A method of manufacturing an ignition device, comprising:
patterning a plurality of resistors in or on a membrane to form heating elements;
thermally isolating the heating elements from an external environment via a cavity disposed immediately adjacent to the heating elements; and
sealing the cavity in an inert environment.
16. The method of claim 15 , wherein the membrane comprises a layer of un-doped silicon carbide.
17. The method of claim 15 , wherein patterning the plurality of resistors comprises patterning doped silicon carbide material within the membrane.
18. The method of claim 15 , wherein patterning the plurality of resistors comprises forming contact pads for electrical connection within the membrane.
19. The method of claim 15 , wherein thermally isolating the heating elements comprises sealing the heating elements in vacuum, or in an inert environment.
20. The method of claim 15 , wherein the plurality of resistors are microscale resistors.