IP Library Granted Patent US 7,816,779
Granted Patent B2
US 7,816,779 · App. 12/217,294 · Granted Oct 19, 2010

Multimode signaling on decoupled input/output and power channels

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,816,779
App. No.
12/217,294
Granted
Oct 19, 2010
Kind
B2
Abstract

A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package coupled to a socket. The socket may also receive a connector that couples the cable to the package. Power supply signals and input/output signals may be decoupled at each end point.

Claims (14)

1. A multimode signaling system comprising:

a pair of end points, each end point including an integrated circuit die;

a multimode signaling path to carry multimode input/output signals between said end points;

a power supply for each of said end points, said power supply to supply power signals to said end point decoupled from said input/output signals; and

at least one of said end points including a connector to connect multimode signals from said multimode signaling path to said die, said connector being a pluggable connector.

2. The system of claim 1 wherein the multimode signaling path includes a multimode board and one of said end points is a die-down, power-up package.

3. The system of claim 2 including a voltage regulator module plugged into the top of said package.

4. The system of claim 2 wherein said pluggable connector is between said multimode board and said package.

5. The system of claim 4 including a heat sink coupled to said package, said heat sink sandwiching said multimode board between said heat sink and said connector.

6. The system of claim 1 wherein the multimode signaling path extends from the die in one end point to the die in the other end point without encountering a discontinuity that creates a return loss greater than −12 decibels over the entire frequency range of interest.

7. The system of claim 1 wherein the multimode signaling path includes a multimode cable and one of said end points includes a socket, a die package mounted on said socket, and a high-speed connector coupled to said cable and mounted on said package.

8. The system of claim 7 wherein said socket is coupled to a printed circuit board.

9. The system of claim 1 wherein the multimode signaling path includes a multimode cable and one of said end points includes a split socket with a first socket region to receive a die package and a second socket region to receive the cable.

10. The system of claim 9 wherein said package is coreless.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2010
From: BRAUNISCH, HENNING; AYGUN, KEMAL
To: INTEL CORPORATION
Reel/Frame 023943/0890 →
Continuity (1)
Related Publication 20100002398A1 · Jan 7, 2010