IP Library Granted Patent US 7,820,920
Granted Patent B2
US 7,820,920 · App. 12/284,036 · Granted Oct 26, 2010

Casing and mounting device

Assignee: Raychem Electronics (Shanghai) Ltd.
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Quick Facts
Patent No.
US 7,820,920
App. No.
12/284,036
Granted
Oct 26, 2010
Kind
B2
Abstract

The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.

Claims (6)

1. A mounting device comprising

an element having soldered pins, and

a casing having

a hollow body for receiving the element and at least one opening to allow the pins to extend from the opening, and

a base coupled to the hollow body, the base (a) extending in a direction perpendicular to the direction of the opening and (b) having a groove extending to the opening on a bottom surface thereof, at least one pin being bent in the groove to form a solder joint.

2. A mounting device according to claim 1 wherein the element is a thermistor.

Assignments (2)
CHANGE OF NAME Recorded Aug 23, 2017
From: RAYCHEM ELECTRONICS (SHANGHAI) LTD.
To: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD.
Reel/Frame 043647/0418 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2008
From: DONG, YONG; PAN, JIEBING; LUO, TIEMING
To: RAYCHEM ELECTRONICS (SHANGHAI) LTD.
Reel/Frame 021907/0953 →
Continuity (1)
Related Publication 20090078460A1 · Mar 26, 2009