Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

1. A method of processing a contact pad, the method comprising:

forming a passivation layer stack over at least an upper surface of a contact pad region, the passivation layer stack comprising at least one passivation layer;

removing a first portion of the passivation layer stack from above the contact pad region, wherein a second portion of the passivation layer stack remains on the contact pad region and covers the contact pad region;

forming an adhesion layer on the passivation layer stack;

patterning the adhesion layer, wherein the adhesion layer is removed from above the contact pad region; and

removing the second portion of the passivation layer stack.

2. The method of claim 1 , further comprising:

forming a reinforcement layer stack over the contact pad region after removing the second portion of the passivation layer stack, the reinforcement layer stack comprising at least one reinforcement layer.

3. The method of claim 2 , wherein forming the reinforcement layer stack comprises:

depositing a first reinforcement layer on the upper surface of the contact pad region;

depositing a second reinforcement layer on the first reinforcement layer; and

depositing a third reinforcement layer on the second reinforcement layer.

4. The method of claim 3 , wherein depositing of at least one of the first, second and/or third reinforcement layers comprises an electroless plating process.

5. The method of claim 1 , wherein forming the passivation layer stack comprises:

depositing a first passivation layer on at least the upper surface of the contact pad region;

depositing a second passivation layer on the first passivation layer; and

depositing a third passivation layer on the second passivation layer.

6. The method of claim 5 , wherein removing the first portion of the passivation layer stack comprises removing the third and the second passivation layer from above the contact pad region.

7. The method of claim 6 , wherein removing the third and the second passivation layer from above the contact pad region comprises an etch process.

8. The method of claim 7 , wherein the etch process comprises:

depositing a photoresist layer over the third passivation layer;

patterning the photoresist layer such that material of the photoresist layer is removed from above the contact pad region;

etching the third and second passivation layer, wherein the first passivation layer is used as an etch stop; and

removing remaining material of the photoresist layer.

9. The method of claim 6 , wherein removing the second portion of the passivation layer stack comprises removing the first passivation layer from the upper surface of the contact pad region.

10. The method of claim 5 , wherein depositing the third passivation layer comprises depositing a layer that has a greater thickness than the first passivation layer or that is harder to etch than the first passivation layer.

11. The method of claim 5 , wherein depositing the first passivation layer comprises depositing a first nitride layer, wherein depositing the second passivation layer comprises depositing an oxide layer or a carbide layer, and wherein depositing the third passivation layer comprises depositing a second nitride layer.

12. The method of claim 1 , wherein patterning the adhesion layer comprises removing the adhesion layer from above the contact pad region and further from above a third portion of the passivation layer stack adjacent to the contact pad region, such that a lateral spacing is formed between the adhesion layer and the contact pad region.

13. The method of claim 1 , wherein the contact pad region comprises copper, aluminum or tungsten.

14. A method of manufacturing an integrated circuit, the method comprising:

forming a passivation layer stack comprising at least one passivation layer, over an upper surface of a surface region of the integrated circuit element, the surface region comprising a contact pad region;

removing a first portion of the passivation layer stack from above the contact pad region, wherein a second portion of the passivation layer stack remains on the contact pad region and covers the contact pad region;

forming an adhesion layer on the passivation layer stack;

patterning the adhesion layer, wherein the adhesion layer is removed from at least above the contact pad region;

removing the second portion of the passivation layer stack from above the contact pad region; and

forming a reinforcement layer stack on the contact pad region after removing the second portion of the passivation layer stack, the reinforcement layer stack comprising at least one reinforcement layer.

15. The method of claim 14 , wherein forming the passivation layer stack comprises:

depositing a first nitride layer on the upper surface of the surface region;

depositing an oxide layer on the first nitride layer; and

depositing a second nitride layer on the oxide layer.

16. The method of claim 15 , wherein removing the first portion of the passivation layer stack comprises etching the second nitride layer and the oxide layer from above the contact pad region using the first nitride layer as an etch stop.