Cluster tool and method for process integration in manufacturing of a photomask
A method and apparatus for process integration in manufacture of a photomask are disclosed. In one embodiment, a cluster tool suitable for process integration in manufacture of a photomask including a vacuum transfer chamber having coupled thereto at least one hard mask deposition chamber and at least one plasma chamber configured for etching chromium. In another embodiment, a method for process integration in manufacture of a photomask includes depositing a hard mask on a substrate in a first processing chamber, depositing a resist layer on the substrate, patterning the resist layer, etching the hard mask through apertures formed in the patterned resist layer in a second chamber; and etching a chromium layer through apertures formed in the hard mask in a third chamber.
1. A method for fabricating a photomask, comprising:
forming a hard mask on a chromium layer disposed on a quartz substrate;
depositing a first patterned photoresist layer on the hard mask layer;
etching the hard mask layer through the patterned photoresist;
removing the patterned photoresist layer on the hard mask layer;
etching the chromium layer to the quartz substrate using the patterned hard mask layer as an etch mask;
removing the hard mask layer;
forming a second patterned photoresist layer on the etched chromium layer;
etching a portion of the quartz substrate through the second patterned photoresist layer; and
removing the second patterned photoresist layer.
2. The method of claim 1 , wherein the forming the hard mask further comprises:
forming an attenuating layer between the hard mask layer and the chromium layer; and
etching the attentuation layer with the chromium layer to the quartz layer.
3. The method of claim 1 , wherein the removing the second patterned photoresist layer further comprises:
in-situ removing the second patterned photoresist layer while etching the portion of the quartz substrate.
4. A method for fabricating a photomask, comprising:
forming a hard mask on a chromium layer disposed on a quartz substrate in a first processing chamber in a cluster tool;
depositing a patterned photoresist layer on the hard mask layer;
etching the hard mask layer through the patterned photoresist layer in a second processing chamber in the cluster system;
in-situ removing the patterned photoresist layer on the hard mask layer in a second processing chamber;
etching the chromium layer to the quartz substrate to form a feature using the patterned hard mask layer as an etch mask in a third processing chamber in the cluster system;
in-situ removing the hard mask layer in the third processing chamber;
forming a second patterned photoresist layer on the etched chromium layer;
etching a portion of the quartz substrate through the second patterned photoresist layer; and
removing the second patterned photoresist layer.
5. A method for fabricating a photomask, comprising:
forming a hardmask on a chromium layer disposed on a quartz substrate in a first chamber of a cluster tool;
patterning a resist layer disposed on the hard mask;
etching the hard mask layer through the patterned resist layer in a second chamber of the cluster tool;
etching the chromium layer to the quartz substrate to form a feature through the hard mask layer in-situ the cluster tool;
measuring critical dimensions of the feature using a metrology tool in-situ the cluster tool; forming a second patterned photoresist layer on the etched chromium layer;
etching a portion of the quartz substrate through the second patterned photoresist layer; and
removing the second patterned photoresist layer.