Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil
A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.
1. A printed wiring board copper foil, comprising:
a nickel plating layer comprising a nickel-cobalt alloy plating layer, a total deposit amount of nickel and cobalt on a side to be bonded to a printed wiring board base material being 5 μg/cm 2 or more to 20 μg/cm 2 or less, a cobalt concentration being 60 mass % or more to 80 mass % or less,
wherein said nickel plating layer is applied to said copper foil by using an insoluble anode and a nickel plating solution comprising water, 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid dissolved in the water, but no nickel chloride and boric acid added therein, wherein a pH of the solution is adjusted to 2 or more and less than 4.
2. The printed wiring board copper foil according to claim 1 , comprising: a rolled copper foil used as an original foil.
3. A printed wiring board copper foil, comprising:
a nickel plating layer comprising a nickel-cobalt alloy plating layer,
a total deposit amount of nickel and cobalt on a side to be bonded to a printed wiring board base material being 5 μg/cm 2 or more to 20 μg/cm 2 or less, a cobalt concentration being 55 mass % or more to 65 mass % or less,
wherein said nickel plating layer is applied to said copper foil by a nickel plating method comprising using an insoluble anode and a nickel plating solution comprising water, 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid dissolved in the water, but no nickel chloride and boric acid added therein, wherein a pH of the solution is adjusted to 2 or more and less than 4.