IP Library › Granted Patent US 7,850,056
Granted Patent B2
US 7,850,056 · App. 12/532,741 · Granted Dec 14, 2010

Electronic component mounting apparatus and electronic component mounting method

Assignee: Panasonic Corporation
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Quick Facts
Patent No.
US 7,850,056
App. No.
12/532,741
Granted
Dec 14, 2010
Kind
B2
Abstract

In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1 , the shape of a center portion 3 a of a tool 3 and the shape of an end portion 3 b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3 a of the tool 3 and at the end portion 3 b of the tool 3 can be eliminated or reduced.

Claims (9)

1. An electronic component mounting apparatus for transmitting ultrasonic vibrations generated from an ultrasonic vibrator, via an ultrasonic horn and a tool, to an electronic component on a wiring board, and causing the electronic component and the wiring board to be bonded to each other, wherein

the tool has a contact face to transmit ultrasound that is to be in contact with the electronic component, and

a length of a center portion of the contact face intersecting with a plane passing through a center axis of the ultrasonic vibrator is greater than a length of each of two end portions of the contact face parallel to the center portion of the contact face.

2. The electronic component mounting apparatus according to claim 1 , wherein a width in a direction of the center portion of the contact face decreases with distance from the center portion.

3. The electronic component mounting apparatus according to claim 1 , further comprising a support member for supporting a nodal portion of ultrasonic vibrations of the ultrasonic horn.

4. An electronic component mounting method of mounting an electronic component on a wiring board by employing ultrasound, by use of the electronic component mounting apparatus according to claim 1 , the method comprising the steps of:

imparting ultrasonic vibrations from the ultrasonic vibrator to the electronic component held by the tool; and

pressing the electronic component against the wiring board, with the tool between the electronic component and the ultrasonic horn.

5. The electronic component mounting apparatus according to claim 1 , further comprising a wiring board holding portion for holding the wiring board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2009
From: NASU, HIROSHI; WATANABE, KATSUHIKO; IMAMURA, HIROYUKI; EBIHARA, HIROSHI; KOBAYASHI, HIROYUKI
To: PANASONIC CORPORATION
Reel/Frame 023506/0297 →
Priority Claims (1)
JP 2007-118211 · Apr 27, 2007 · national
Continuity (1)
Related Publication 20100065613A1 · Mar 18, 2010