Method and system for a laser diode bar array assembly
A laser diode array is formed on a heat sink having an insulating layer in which a plurality of grooves is formed through the ceramic layer and to or into the heat sink. A laser diode stack is soldered to the ceramic layer.
1. A laser diode array comprising
a heat sink;
a metallized insulating layer mounted on the heat sink, said metallized insulating layer having a plurality of slots or grooves formed through the insulating layer to or into the heat sink; and
a laser diode bar array comprising a plurality of laser diode bars separated by electrically conducting spacers mounted to the insulating layer with the laser diode bars located over the slots or grooves.
2. A laser diode array as claimed in claim 1 , wherein the heat sink and the spacers are formed of the same material.
3. A laser diode array as claimed in claim 1 , wherein the heat sink and the spacers are formed from different materials that are closely matched for thermal expansion.
4. The laser diode array as claimed in claim 1 , wherein the insulating layer is mounted to the heat sink by solder.
5. The laser diode array as claimed in claim 1 , wherein the laser diode bar array is mounted to the insulating layer by solder.
6. The laser diode array as claimed in claim 1 , wherein the slots or grooves through the insulating layer are formed in place after the insulating layer is mounted to the heat sink.
7. The laser diode array as claimed in claim 1 , wherein the heat sink is formed of a material selected from the group consisting of copper, tungsten, a copper/tungsten alloy, diamond, composites containing diamond, graphite and beryllium oxide.
8. The laser diode assembly as claimed in claim 4 , wherein the insulating material comprises a ceramic, and the solder comprises a high temperature solder.
9. The laser diode assembly as claimed in claim 4 , wherein the insulating material comprises a composite material containing diamond, and the solder comprises a high temperature solder.
10. The laser diode assembly as claimed in claim 8 , wherein the high temperature solder comprises an AuGe solder or an AuSn solder.
11. The laser diode assembly as claimed in claim 5 , wherein the solder comprises a high temperature solder.
12. The laser diode assembly as claimed in claim 11 , wherein the solder comprises an AuGe solder or an AuSn solder.
13. A method of forming a laser diode array as claimed in claim 1 , comprising:
providing a heat sink bonded to an insulating layer;
forming slots or grooves through the insulating layer to or into the heat sink; and
bonding laser diode bars aligned over the grooves.
14. The method as claimed in claim 13 , wherein the slots or grooves are formed parallel to one another.
15. The method as claimed in claim 13 , wherein the laser diode bars are bonded over the slots or grooves by soldering.
16. The method as claimed in claim 15 , wherein a hard solder is used in the soldering.
17. The method as claimed in claim 16 , wherein the hard solder comprises an AuGe solder or an AuSn solder.