Mounting structure and electro optical device

1. A mounting structure comprising:

a substrate;

a component mounted on the substrate;

substrate-side first wirings disposed over the substrate, the substrate-side first wirings extending in a first direction;

substrate-side first terminals disposed over the substrate in a mounting area where the component is mounted on the substrate, the substrate-side first terminals being connected to corresponding substrate-side first wirings;

substrate-side second wirings disposed on the substrate, the substrate-side second wirings extending in the first direction, and the substrate-side second wirings passing between corresponding adjacent two substrate-side first wirings and between corresponding adjacent two substrate-side first terminals;

substrate-side second terminals disposed over the substrate in the mounting area, the substrate-side second terminals being connected to corresponding substrate-side second wirings;

component-side first terminals provided to the component, one of the component-side first terminals overlapping with the corresponding substrate-side first terminal in plan view and being connected electrically with the corresponding substrate-side first terminal; and

component-side second terminals provided to the component, one of the component-side second terminals overlapping with a corresponding substrate-side second terminal in plan view and being connected electrically with the corresponding substrate-side second terminal,

wherein widths Wa 1 , Wa 2 , Wf 1 and Wf 2 satisfy all of the following relationships:

Wa1<Wa2

Wf1>Wf2

Wa1<Wf1

Wa2>Wf2;

wherein

the width Wa 1 is a dimension of the substrate-side first terminal in a second direction perpendicular to the first direction,

the width Wa 2 is a dimension of the substrate-side second terminal in the second direction,

the width Wf 1 is a dimension of the component-side first terminal in the second direction, and

the width Wf 2 is a dimension of the component-side second terminal in the second direction, and

each of the substrate-side first wirings does not pass between corresponding adjacent two substrate-side second terminals.

2. The mounting structure according to claim 1 , wherein the substrate-side second wirings linearly extend in the first direction to have a same width Wd 2 in the mounting area; and

widths Wa 2 and Wd 2 satisfy the following relationship:

Wd2<Wa2.

3. The mounting structure according to claim 1 , wherein the substrate-side first wirings linearly extend in the first direction to have a same width Wd 1 near the mounting area; and

widths Wa 1 and Wd 1 satisfy the following relationship:

Wa1=Wd1.

4. The mounting structure according to claim 1 , wherein

the substrate-side first wirings linearly extend in the first direction to have a same width Wd 1 near the mounting area,

the substrate-side second wirings linearly extend in the first direction to have a same width Wd 2 in the mounting area, and

the widths Wd 1 and Wd 2 satisfy the following relationship:

Wd1=Wd2.

5. The mounting structure according to claim 1 , wherein

one of the component-side first terminals is electrically connected to corresponding substrate-side first terminal with an anisotropic conductive film that is provided between the substrate and the component in the mounting area, and

one of the component-side second terminals is electrically connected to corresponding substrate-side second terminal with the anisotropic conductive film.

6. The mounting structure according to claim 1 , wherein the mounting area except for regions where the substrate-side first terminals and the substrate-side second terminals are provided is covered with an insulating layer.

7. The mounting structure according to claim 1 , wherein the component is a flexible printed circuit.

8. The mounting structure according to claim 1 , wherein the component is an IC.

9. An electro optical device comprising:

a first substrate;

a component mounted on the first substrate; and

a pixel including a pixel electrode, the pixel electrode being disposed over the first substrate;

substrate-side first wirings disposed over the first substrate, the substrate-side first wirings extending in a first direction;

substrate-side first terminals disposed over the first substrate in a mounting area where the component is mounted on the first substrate, the substrate-side first terminals being connected to corresponding substrate-side first wirings;

substrate-side second wirings disposed on the first substrate, the substrate-side second wirings extending in the first direction, and substrate-side second wirings passing between corresponding adjacent two substrate-side first wirings and between corresponding adjacent two substrate-side first terminals;

substrate-side second terminals disposed over the first substrate in the mounting area, the substrate-side second terminals being connected to corresponding substrate-side second wirings;

component-side first terminals provided to the component, one of the component-side first terminals overlapping with the corresponding substrate-side first terminal in plan view and being connected electrically with the corresponding substrate-side first terminal; and

component-side second terminals provided to the component, one of the component-side second terminals overlapping with a corresponding substrate-side second terminal in plan view and being connected electrically with the corresponding substrate-side second terminal,

wherein widths Wa 1 , Wa 2 , Wf 1 and Wf 2 satisfy all of the following relationships:

Wa1<Wa2

Wf1>Wf2

Wa1<Wf1

Wa2>Wf2;

wherein

the width Wa 1 is a dimension of the substrate-side first terminal in a second direction perpendicular to the first direction,

the width Wa 2 is a dimension of the substrate-side second terminal in the second direction,

the width Wf 1 is a dimension of the component-side first terminal in the second direction, and

the width Wf 2 is a dimension of the component-side second terminal in the second direction, and

each of the substrate-side first wirings does not pass between corresponding adjacent two substrate-side second terminals.

10. The electro optical device according to claim 9 , wherein a liquid crystal layer is held between the first substrate and a second substrate, the second substrate being disposed opposite to the first substrate.

11. The electro optical device according to claim 9 , wherein an electro-luminescence element is disposed over the first substrate.