Transistor of semiconductor device and method of fabricating the same
View Patent ↗Provided are a transistor of a semiconductor device and method of fabricating the same. The transistor includes: an epitaxy substrate disposed on a semi-insulating substrate and having a buffer layer, a first Si planar doping layer, a first conductive layer, a second Si planar doping layer, and a second conductive layer, which are sequentially stacked, the second Si planar doping layer having a doping concentration different from that of the first Si planar doping layer; a source electrode and a drain electrode diffusing into the first Si planar doping layer to a predetermined depth and disposed on both sides of the second conductive layer to form an ohmic contact; and a gate electrode disposed on the second conductive layer between the source and drain electrodes and being in contact with the second conductive layer. In this structure, both isolation and switching speed of the transistor can be increased. Also, the maximum voltage limit applied to the transistor is increased due to increases in gate turn-on voltage and threshold voltage and a reduction in parallel conduction element. As a result, the power handling capability of the transistor can be improved, thus improving a high-power low-distortion characteristic and an isolation characteristic.
1. A method of fabricating a transistor of a semiconductor device, comprising steps of:
sequentially forming a buffer layer, a first Si planar doping layer, a first conductive layer, a second Si planar doping layer, and a second conductive layer on a semi-insulating substrate, the second Si planar doping layer having a doping concentration different from that of the first Si planar doping layer;
forming a source electrode and a drain electrode extending to the first Si planar doping layer by first forming a metal thin layer over the second conductive layer, and after forming the metal thin layer over the second conductive layer, then causing the metal thin layer over the second conductive layer to diffuse to and within the first Si planar doping layer to a predetermined depth such that the metal thin layer is alloyed with the second conductive layer, the second Si planar doping layer, the first conductive layer and the first Si planar doping layer and forms an ohmic contact;
etching a portion of the second conductive layer to a predetermined depth; and
forming a gate electrode on the etched second conductive layer.
2. The method according to claim 1 , wherein the step of forming the buffer layer includes steps of:
forming an AlGaAs/GaAs superlattice buffer layer for preventing substrate leakage current during the operation of the semiconductor device; and
forming an AlGaAs buffer layer on the AlGaAs/GaAs superlattice buffer layer using undoped AlGaAs.
3. The method according to claim 1 , wherein the doping concentration of the second Si planar doping layer is 4 times higher than that of the first Si planar doping layer.
4. The method according to claim 1 ,
wherein the step of forming the first conductive layer includes steps of:
forming a first spacer on the first Si planar doping layer using undoped AlGaAs;
forming a channel layer on the first spacer using undoped InGaAs; and
forming a second spacer on the channel layer using undoped AlGaAs, and
wherein the step of forming the second conductive layer includes steps of:
forming a Schottky contact layer on the second Si planar doping layer using undoped AlGaAs; and
forming a capping layer on the Schottky contact layer using undoped GaAs.
5. The method according to claim 1 , wherein the step of forming the source and drain electrodes includes a step of annealing the metal thin layer formed over the second conductive layer using a rapid thermal anneal (RTA) process such that particles of the thin metal layer diffuse into the second conductive layer, the first Si planar doping layer, and the layers between the second conductive layer and the first Si planar doping layer, such that the source and drain electrodes are formed.
6. The method according to claim 1 , wherein the step of etching the portion of the second conductive layer is performed using a recess process.
7. The method according to claim 1 , further comprising, before the step of forming the gate electrode, a step of removing a surface oxide layer of a predetermined thickness from the etched second conductive layer.
8. The method of claim 1 , wherein the thin metal layer includes a layer of AuGe/Ni/Au.