Method and apparatus for precision polishing of optical components

1. A method for polishing objects, comprising:

a. providing a polishing apparatus comprised of:

i. a rotary positioning device comprising a turret rotatable around a turret axis;

ii. a base for affixing structures thereto, the base mounted on the turret and comprising a plate having a surface defining a plane perpendicular to the turret axis;

iii. a drive wheel connected to a rotatable shaft, the drive wheel having a perimeter, and the rotatable shaft disposed in a housing joined to the plate and having a rotational axis that is substantially parallel to the turret axis; and

iv. a polishing wheel assembly comprising an elongated arm including a proximal end joined to the base, and a distal end; a rotatable polishing wheel supported at the distal end of the elongated arm, the rotatable polishing wheel having a perimeter; and a polishing belt comprising an inner surface and an outer surface, the inner surface engageable with the perimeters of the drive wheel and the polishing wheel;

b. contacting the outer surface of the polishing belt to a contact region of the surface of the object; and

c. controlling the contact region by rotating the elongated arm around the turret axis.

2. The method of claim 1 , further comprising moving the apparatus in a linear path with respect to the object.

3. The method of claim 2 , further comprising superimposing a circular motion on the linear path.

4. The method of claim 1 , further comprising moving the apparatus with respect to the object in a path selected from arcuate, zigzag, sinusoidal, and combinations thereof.

5. The method of claim 1 , further comprising holding the object stationary during polishing.

6. The method of claim 1 , further comprising rotating the object during polishing.

7. The method of claim 6 , further comprising varying the rotational speed of the object during polishing.

8. The method of claim 1 , further comprising measuring the object to be polished prior to polishing, and determining polishing process parameters for operation of the apparatus during polishing.

9. The method of claim 1 , wherein the polishing belt is a continuous loop of belt, and the method further comprises driving the continuous loop of belt in repeated cycles around the perimeters of the drive wheel and the polishing wheel.

10. The method of claim 1 , wherein the polishing belt is wound on a first spool, and the method further comprises unwinding the belt from the first spool, around a portion of the perimeter of the polishing wheel, and winding the belt onto a second spool.

11. The method of claim 1 , further comprising delivering a liquid to the contact region during polishing.

12. The method of claim 1 , wherein the apparatus is further comprised of a dressing assembly including a stripping surface that is contactable with the outer surface of the polishing belt, and the method further comprises dressing the polishing belt with the stripping surface.

13. The method of claim 12 , wherein the dressing assembly is comprised of a dressing belt having a surface that is the stripping surface and the method further comprises contacting the stripping surface of the dressing belt with the outer surface of the polishing belt.

14. The method of claim 12 , wherein the dressing assembly is comprised of an abrasive bar having a surface that is the stripping surface and the method further comprises contacting the stripping surface of the abrasive bar with the outer surface of the polishing belt.

15. The method of claim 12 , wherein the dressing assembly is comprised of a dressing wheel having a surface that is the stripping surface and the method further comprises contacting the stripping surface of the dressing wheel with the outer surface of the polishing belt.

16. The method of claim 1 , wherein the apparatus is further comprised of a position measuring device comprising a laser and a photodetector, and the method further comprises measuring the position of the polishing wheel with respect to the object.

17. The method of claim 16 , further comprising adjusting a parameter of the polishing apparatus after measuring the position of the polishing wheel with respect to the object.

18. The method of claim 1 , wherein the apparatus is further comprised of a polishing spot measurement tool comprising a housing containing a light source and a light detector, and the method further comprises measuring the contact region between the polishing belt and the surface of the object.

19. The method of claim 18 , wherein the housing of the spot measurement tool is deployable and retractable, and the method further comprises deploying the spot measurement tool, measuring the contact region, and retracting the spot measurement tool.

20. The method of claim 18 , further comprising adjusting a parameter of the polishing apparatus after measuring the contact region.