Packaged device and method of manufacturing the same
A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.
1. A packaged device comprising:
a package having an inner surface defining a closed internal space;
a device chip fixed to the package in the internal space; and
a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip,
wherein the package includes a package main body having the inner surface and a cover that closes the inner surface, and the cover includes a translucent, optical glass plate.
2. The packaged device according to claim 1 , further comprising an electronic component disposed in the internal space, and the parylene film further covers at least a part of a surface of the electronic component.
3. The packaged device according to claim 1 , wherein a micro movable element having a fixed portion and a movable portion is formed in the device chip.
4. The packaged device according to claim 1 , wherein an inner surface of the optical glass plate is not covered with the parylene film.
5. The packaged device according to claim 1 , wherein an entire inner surface of the optical glass plate is covered with the parylene film.
6. The packaged device according to claim 1 , wherein the parylene film covers at least a part of an outer surface of the package.