Liquid cooling system
A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.
1. A component cooling system, comprising:
a board;
a plurality of heat producing components (HPCs) coupled to the board;
a plurality of heat spreaders, each of the plurality of heat spreaders coupled to a corresponding HPC of the plurality of HPCs, wherein the each of the plurality of heat spreaders includes a liquid cooling device engagement surface and the plurality of liquid cooling device engagement surfaces are co-planar;
a mounting structure that is operable to be coupled to the board adjacent to the plurality of HPCs; and
a liquid cooling device including a heat spreader engagement surface, wherein the liquid cooling device is operable to be coupled to the board using the mounting structure such that the heat spreader engagement surface engages each of the co-planar liquid cooling device engagement surfaces on the plurality of heat spreaders while the plurality of heat spreaders are coupled to the plurality of HPCs and the plurality of HPCs are coupled to the board, and wherein the liquid cooling device is operable to be decoupled from the board such that the heat spreader engagement surface disengages each of the co-planar liquid cooling device engagement surfaces on the plurality of heat spreaders while the plurality of heat spreaders remain coupled to the plurality of HPCs and the plurality of HPCs remain coupled to the board.
2. The system of claim 1 , further comprising:
a stiffening member mounted to the board opposite the mounting structure.
3. The system of claim 1 , further comprising: a plurality of retaining clips, each retaining clip securing the each of the plurality of heat spreaders to the corresponding HPC of the plurality of HPCs.
4. The system of claim 1 , further comprising:
at least one fitting located on the liquid cooling device, wherein the at least one fitting is operable to couple a liquid conduit to the liquid cooling device.
5. The system of claim 4 , wherein the mounting structure comprises
at least one coupling member that allows the liquid cooling device to decouple from the mounting structure without disconnecting the liquid conduit from the at least one fitting when the liquid conduit is connected to the at least one fitting.
6. The system of claim 5 , wherein the decoupling of the liquid cooling device from the mounting structure allows any of the plurality of HPCs to be decoupled from the board.
7. An information handling system (IHS), comprising:
an IHS chassis; a board mounted in the IHS chassis;
a processor mounted to the board;
a plurality of heat producing components (HPCs) coupled to the board and the processor;
a plurality of heat spreaders, each of the plurality of heat spreaders coupled to a corresponding HPC of the plurality of HPCs, wherein the each of the plurality of heat spreaders includes a liquid cooling device engagement surface and the plurality of liquid cooling device engagement surfaces are co-planar;
a mounting structure that is operable to be coupled to the board adjacent to the plurality of HPCs; and
a liquid cooling device including a heat spreader engagement surface, wherein the liquid cooling device is operable to be coupled to the board using the mounting structure such that the heat spreader engagement surface engages each of the co-planar liquid cooling device engagement surfaces on the plurality of heat spreaders while the plurality of heat spreaders are coupled to the plurality of HPCs and the plurality of HPCs are coupled to the board, and wherein the liquid cooling device is operable to be decoupled from the board such that the heat spreader engagement surface disengages each of the co-planar liquid cooling device engagement surfaces on the plurality of heat spreaders while the plurality of heat spreaders remain coupled to the plurality of HPCs and the plurality of HPCs remain coupled to the board.
8. The system of claim 7 , further comprising:
a stiffening member mounted to the board opposite the mounting structure.
9. The system of claim 7 , further comprising: a plurality of retaining clips, each retaining clip securing the each of the plurality of heat spreaders to the corresponding HPC of the plurality of HPCs.
10. The system of claim 7 , further comprising:
at least one fitting located on the liquid cooling device, wherein the at least one fitting is operable to couple a liquid conduit to the liquid cooling device.
11. The system of claim 10 , further comprising:
at least one coupling member that allows the liquid cooling device to decouple from the mounting structure without disconnecting the liquid conduit from the at least one fitting when the liquid conduit is connected to the at least one fitting.
12. The system of claim 11 , wherein the decoupling of the liquid cooling device from the mounting structure allows any of the plurality of HPCs to be decoupled from the board.
13. A method for cooling a plurality of heat producing components (HPCs), comprising:
providing a board comprising the plurality of HPCs coupled to the board, wherein a plurality of heat spreaders, each of the plurality of heat spreaders coupled to a corresponding HPC of the plurality of HPCs, the each of the plurality of heat spreaders includes a liquid cooling device engagement surface, and the plurality of liquid cooling device engagement surfaces are co-planar;
coupling a liquid cooling device that includes a heat spreader engagement surface to the board while the plurality of heat spreaders are coupled to the plurality of HPCs and the plurality of HPCs are coupled to the board such that the heat spreader engagement surface engages each of the co-planar liquid cooling device engagement surfaces on the plurality of heat spreaders;
coupling a mounting structure to the board adjacent to the plurality of HPCs;
coupling the liquid cooling device to the mounting structure such that the heat spreader engagement surface on the liquid cooling device engages each of the co-planar liquid cooling device engagement surfaces on the plurality of heat spreaders;
moving a liquid through the liquid cooling device to cool the plurality of HPCs; and
decoupling the liquid cooling device from the board while the plurality of heat spreaders remain coupled to the plurality of HPCs and the plurality of HPCs remain coupled to the board such that the heat spreader engagement surface disengages each of the co-planar liquid cooling device engagement surface on the plurality of heat spreaders.
14. The method of claim 13 , further comprising: using a plurality of retaining clips, each retaining clip securing the each of the plurality of heat spreaders to the corresponding HPC of the plurality of HPCs.
15. The method of claim 13 , further comprising:
connecting a liquid conduit to at least one fitting located on the liquid cooling device such that the liquid may be moved through the liquid cooling device.
16. The method of claim 15 , further comprising: decoupling the liquid cooling device from the mounting structure without disconnecting the liquid conduit from the at least one fitting; and decoupling at least one of the plurality of HPCs from the board.