Nitride semiconductor device
View Patent ↗A nitride semiconductor device include an n-type nitride semiconductor layer; a p-type nitride semiconductor layer; and an active layer formed between the n-type and p-type nitride semiconductor layers. The active layer has an alternately-layered structure of a plurality of quantum well layers and a plurality of quantum barrier layers, each alternately stacked on each of the quantum well layers. The alternately-layered structure includes a unit multi-layer structure and a thick quantum barrier well. The unit multi-layer structure includes a first quantum well layer, a second quantum well layer formed, a tunneling quantum barrier layer and a crystal quality-improving layer. The thick quantum barrier well may be formed adjacent to the first and second quantum well layers, with a thickness thereof greater than that of the first and second quantum well layers.
1. A nitride semiconductor device comprising:
an n-type nitride semiconductor layer;
a p-type nitride semiconductor layer; and
an active layer formed between the n-type and p-type nitride semiconductor layers, wherein the active layer has an alternately-layered structure of a plurality of quantum well layers and a plurality of quantum barrier layers, each alternately stacked on each of the quantum well layers,
wherein the alternately-layered structure of a plurality of quantum well layers and a plurality of quantum barrier layers comprises:
a plurality of unit multi-layer structure including a first quantum well layer, a second quantum well layer formed adjacent to the first quantum well layer at a position facing the p-type nitride semiconductor layer, the second quantum well layer having a quantum level higher than that of the first quantum well layer, a tunneling quantum barrier layer disposed between the first and second quantum well layers and a crystal quality-improving layer formed adjacent to the second quantum well layer at a position facing the p-nitride semiconductor layer, the crystal quality-improving layer comprising a quantum barrier layer having a thickness greater than that of the tunneling quantum barrier layer; and
a thick quantum well formed to be between the unit multi-layer structures, adjacent to the first and second quantum well layers, with a thickness thereof being greater than that of the first and second quantum well layers.
2. The nitride semiconductor device of claim 1 , wherein the active layer comprises at least two of the unit multi-layer structures, which are repeatedly stacked on each other.
3. The nitride semiconductor device of claim 2 , wherein the unit multi-layer structures are repeatedly stacked on each other 2 to 30 times.
4. The nitride semiconductor device of claim 2 , wherein the thick quantum well layer is disposed between the unit multi-layer structures, forming an interface with a corresponding one of the tunneling quantum barrier wells of the unit multi-layer structures.
5. The nitride semiconductor device of claim 1 , wherein a part of the alternately-layered structure of a plurality of quantum well layers and a plurality of quantum barrier layers comprises a super-lattice structure.
6. The nitride semiconductor device of claim 5 , wherein the super-lattice structure of the active layer is disposed more adjacent to the n-type nitride semiconductor structure than the unit multi-layer structure is.
7. The nitride semiconductor device of claim 5 , wherein the quantum well layers and the quantum barrier layers included in the super-lattice structure have a thickness ranging from 20 to 60 Å.
8. The nitride semiconductor device of claim 5 , wherein the super-lattice structure includes five to fifteen of the quantum well layers and five to fifteen of the quantum barrier layers.
9. The nitride semiconductor device of claim 5 , wherein the active layer comprises one to five of the unit multi-layer structures.
10. The nitride semiconductor device of claim 5 , wherein the thick quantum well layer is formed between the super-lattice structure and the unit multi-layer structure.
11. The nitride semiconductor device of claim 10 , wherein the thick quantum well layer of the active layer is formed to be more adjacent to the p-type nitride semiconductor layer than to the n-type nitride semiconductor layer.
12. The nitride semiconductor device of claim 10 , wherein the quantum barrier layer formed between the thick quantum barrier well layer and the first quantum well layer of the unit multi-layer structure adjacent to the thick quantum barrier well layer has a thickness ranging from 20 to 60 Å.
13. The nitride semiconductor device of claim 1 , wherein the second quantum well layer has a thickness smaller than the first quantum well layer.
14. The nitride semiconductor device of claim 1 , wherein the first quantum well layer has a thickness ranging from 20 to 60 Å.
15. The nitride semiconductor device of claim 1 , wherein the second quantum well layer has a thickness ranging from 10 to 50 Å.
16. The nitride semiconductor device of claim 1 , wherein the tunneling quantum barrier layer has a thickness ranging from 10 to 80 Å.
17. The nitride semiconductor device of claim 1 , wherein the crystal quality-improving layer has a thickness ranging from 30 to 200 Å.
18. The nitride semiconductor device of claim 1 , wherein the thick quantum well layer has a thickness ranging from 50 to 100 Å.
19. The nitride semiconductor device of claim 1 , wherein the quantum level of the second quantum well layer is realized by doping.
20. The nitride semiconductor device of claim 1 , wherein the unit multi-layer structure further includes:
a third quantum well layer formed adjacent to the first quantum well layer in a position facing the n-type nitride semiconductor layer, the third quantum well layer having a quantum level higher than that of the first quantum well layer; and
a second tunneling quantum well layer formed between the first and third quantum well layers, with a thickness thereof allowing carriers to pass through via tunneling.