Production of an electrical component and component

1. An electrical component comprising:

a base body comprising ceramic;

metallization surfaces comprising component structures on the base body;

a passivation layer that is electrically insulating and over a surface of the base body;

solder contacts on the passivation layer; and

through-hole contacts inside the base body that are electrically connected to corresponding metallization surfaces;

wherein the solder contacts are electrically connected to corresponding through-hole contacts through the passivation layer;

wherein the passivation layer comprises a first material and the solder contacts comprise a second material;

wherein the solder contacts are electrically connected to corresponding through-hole contacts over an area where the first and second materials mix; and

wherein (i) the first material comprises a glass and the second material comprises a metal paste comprising a glass constituent, or (ii) the first material comprises an organic polymer and the second material comprises a conductive adhesive comprising a polymer matrix.

2. The electrical component of claim 1 , wherein at least one through-hole contact projects from the surface of base body.

3. The electrical component of claim 1 , wherein, prior to hardening, the first and the second materials comprise free-flowing, hardenable constituents.

4. The electrical component of claim 3 , wherein the first material and the second material are hardened by burning-in at roughly 600-900° C.

5. The electrical component of claim 3 , wherein the first material and the second material are hardened in by burning-in at roughly 150-250° C.

6. The electrical component of claim 1 , wherein the second material comprises electrically conductive portions; and

wherein a concentration of the electrically conductive portions decreases from solder contacts to through-hole contacts.

7. The electrical component of claim 1 , wherein a hardening temperature for the solder contacts is higher than a hardening temperature for the passivation layer.

8. The electrical component of claim 1 , wherein the base body is comprised of stacked ceramic layers.

9. The electrical component of claim 1 , wherein the base body comprises:

a green ceramic structure comprising:

a pattern on a surface of the ceramic green ceramic structure; and

a through-hole through the pattern, an electrically conductive filling being in the through-hole to form a through-hole contact;

wherein base body comprising a hardened version of the green ceramic structure and the electrically conductive filling.

10. The electrical component of claim 1 , wherein the glass comprises one or more of aluminosilicate glasses, borate glasses, borosilicate glasses, silicate glasses, zinc borate classes, and phosphate glasses.

11. The electrical component of claim 1 , further comprising:

at least one intermediate metal layer on a solder contact.

12. The electrical component method of claim 11 , wherein the at least one intermediate metal layer comprises at least one Ni, Pd, Cu, Cr, Ag and Au.

13. The electrical component of claim 1 , further comprising:

a solder ball above a solder contact.

14. The electrical component of claim 13 , wherein the solder ball comprises at least one of Sn, SnPb, SnAgCu, SnAgCuBi, SnZn, and SnAg.

15. The electrical component of claim 1 wherein the through-hole contacts comprise at least one of Ag, Pd, Pt, AgPd, AgPt, AgPdPt, Ni, and Cu.

16. The electrical component of claim 1 , wherein the electrical component comprises a varistor; and

wherein the ceramic comprises ZnO—Bi or ZnO—Pr.

17. The electrical component of claim 1 , wherein the electrical component comprises a capacitor; and

wherein the ceramic comprises a material from one of temperature classes COG, X7R, Z5U, Y5V and HQM.

18. The electrical component of claim 1 , wherein the ceramic comprises an HTCC or an LTCC material.

19. The electrical component of claim 1 , wherein the ceramic comprises a ferrite ceramic.