Plasma processing apparatus

1. A plasma processing apparatus, comprising:

a processing chamber having a side wall, an interior wall, and top and bottom surfaces which are mounted on the side wall, and wherein the processing chamber and interior wall define at least two internal processing stations, and wherein the side wall defines individual transfer ports which facilitate the movement of a semiconductor work piece into, and out of, the respective processing stations, and wherein an opening is defined between the top surface of the processing chamber, and the interior wall, and which couples the respective processing stations in fluid flowing relation, one relative to the other;

two grounding rings wherein each grounding ring is mounted on the top surface of the processing chamber, and within each of the processing stations, and wherein a gap is defined between each of the grounding rings and the interior wall, and the opening is adjacent to each of the grounding rings;

two first electrodes wherein each first electrode is mounted on the top surface of the processing chamber, and within each of the processing stations, and wherein the grounding ring surrounds the respective first electrodes;

two second electrodes wherein each second electrode is mounted on the bottom surface of the processing chamber, and within each of the processing stations;

a protection assembly positioned within each of the processing stations, and moveable relative to the interior and side walls of the processing chamber and within the gap defined between each of the grounding rings and the interior wall from a first position, wherein the protection assembly blocks the respective transfer ports, to a second position where the respective transfer ports are open, and wherein the protection assembly further defines a channel which selectively couples the respective processing stations in fluid flowing relation, one relative to the other.

2. A plasma processing apparatus as claimed in claim 1 , wherein the opening has a width to length ratio of less than about 1:3.

3. A plasma processing apparatus as claimed in claim 1 , and wherein the opening defined by the wall has a linear or nonlinear shape, and wherein the plasma processing apparatus is selected from the group comprising plasma deposition equipment, and plasma etching equipment.

4. A plasma processing apparatus as claimed in claim 1 , and wherein the drive assembly moves the protection assembly along a course of travel from a first position where the protection assembly is positioned in covering relation relative to the opening, and the channel defined by the protection assembly is not oriented in fluid flowing relation relative to the opening; and a second position where the protection assembly is positioned in covering relation relative to the opening, and the channel defined by the protection assembly is oriented in fluid flowing relation relative to the opening.

5. A plasma processing apparatus as claimed in claim 1 , and further comprising a drive assembly coupled in force transmitting relation relative to the protection assembly and which is operable to move the protection assembly between the first and second positions.

6. A plasma processing apparatus as claimed in claim 1 , and wherein the drive assembly moves the protection assembly along a course of travel from the first position where the protection assembly blocks the respective transfer ports, to the second position where the respective transfer ports are open, and wherein the protection assembly when located in the first position, is located, at least in part, within the gap which is defined between the respective grounding rings and the interior wall, and wherein the channel defined by the protection assembly couples the respective internal processing stations in fluid flowing relation, one relative to the other, and wherein the protection assembly when located in the second position is positioned substantially within the gap which is defined between the respective grounding rings and the interior wall, and the channel defined by the protection assembly does not couple the respective processing stations in fluid flowing relation one relative to the other.

7. A plasma processing apparatus as claimed in claim 6 , and wherein the drive assembly comprises a motor which can be selectively controlled, and a drive linkage which is coupled the protection assembly and disposed in force receiving relation relative to the motor.

8. A plasma processing apparatus as claimed in claim 7 , and wherein the motor has internal gears which facilitate the movement of the protection assembly between the first and second positions.

9. A plasma processing apparatus as claimed in claim 1 , and wherein the channel which is defined by the protection assembly has a linear or nonlinear shape.

10. A plasma processing apparatus as claimed in claim 1 , and wherein the plasma processing apparatus is selected from the group comprising plasma deposition equipment, and plasma etching equipment.