Nitride semiconductor light emitting device
There is provided a nitride semiconductor light emitting device having high internal quantum efficiency by accelerating recombination radiation while employing a multiple quantum well structure in which each of well layers has a relatively large thickness. The nitride semiconductor light emitting device is provided with a nitride semiconductor lamination portion ( 6 ) provided on a substrate ( 1 ). The nitride semiconductor lamination portion ( 6 ) includes at least an active layer ( 4 ) in which a light emitting portion is formed. And the active layer is constituted with a multiple quantum well structure formed by laminating well layers ( 7 ) made of In x Ga 1-x N (0<x≦1), and barrier layers ( 8 ) made of Al y In z Ga 1-y-z N (0≦y<1, 0≦z<1, 0≦y+z<1, z<x) alternately. In addition, one of the well layers is divided at least into a first well layer ( 7 a ) and a second well layer ( 7 b ) by a thin film barrier layer ( 7 c ) made of Al v In w Ga 1-v-w N (0≦v<1, 0≦w<1, 0≦v+w<1, w<x), and the thin film barrier layer is formed so as to have a thickness of one atomic layer or more and 20 Angstroms or less.
1. A nitride semiconductor light emitting device comprising:
a substrate; and
a nitride semiconductor lamination portion provided on the substrate, the nitride semiconductor lamination portion comprising an active layer in which at least a light emitting portion is formed, the active layer being constituted with a multiple quantum well structure formed by laminating well layers made of In x Ga 1-x N (0<x≦1) and barrier layers made of Al y In z Ga 1-y-z N (0≦y<1, 0≦z<1, 0≦y+z<1, z<x) alternately,
wherein one of the well layers is divided at least into a first well layer and a second well layer by a thin film barrier layer made of Al v In w Ga 1-v-w N (0≦v<1, 0≦w<1, 0≦v+w<1, w<x), the thin film barrier layer being formed so as to have a thickness of one atomic layer or more and 20 Angstroms or less,
wherein each of the first well layer and the second well layer has a thickness that is (b 1 +10) Angstroms or more and 100 Angstroms or less, and
wherein the thickness of the film barrier layer is b 1 Angstroms, and a thickness of the barrier layer is 50 Angstroms or more and 100 Angstroms or less.
2. The nitride semiconductor light emitting device according to claim 1 , wherein the thickness of the thin film barrier layer is 15 Angstroms or less.
3. The nitride semiconductor light emitting device according to claim 1 , wherein the well layers of the active layer are formed so as to have a band gap energy emitting green light or yellow light.
4. The nitride semiconductor light emitting device according to claim 3 , wherein the thin film barrier layer is made of a material having a band gap energy larger than that of the well layers by 0.4 eV or more.
5. The nitride semiconductor light emitting device according to claim 1 , wherein the thin film barrier layer is formed at the middle of one well layer.
6. The nitride semiconductor light emitting device according to claim 1 , wherein one of the well layers is divided into three or more by forming two or more thin film barrier layers.
7. The nitride semiconductor light emitting device according to claim 1 , wherein one of the barrier layers is formed with a thickness of 3 to 20 nm and the one well layer is formed so that a total thickness of each well layer divided by the thin film barrier layer is approximately equal to a thickness of the one of the barrier layers.
8. A nitride semiconductor light emitting device comprising:
a substrate; and
a nitride semiconductor lamination portion provided on the substrate, the nitride semiconductor lamination portion comprising an active layer in which at least a light emitting portion is formed, the active layer being constituted with a multiple quantum well structure formed by laminating well layers made of In x Ga 1-x N (0<x≦1) and barrier layers made of Al y In z Ga 1-y-z N (0≦y<1, 0≦z<1, 0≦y+z<1, z<x) alternately,
wherein one of the well layers is divided at least into a first well layer and a second well layer by a thin film barrier layer made of Al v In x Ga 1-v-w N (0≦v<1, 0≦w<1, 0≦v+w<1, w<x), the thin film barrier layer being formed so as to have a thickness that is one atomic layer or more and 20 Angstroms or less, and
wherein one of the barrier layers is formed with a thickness of 3 to 20 nm and the one well layer is formed so that a total thickness of each well layer divided by the thin film barrier layer is approximately equal to a thickness of the one of the barrier layers.
9. The nitride semiconductor light emitting device according to claim 8 , wherein the thickness of the thin film barrier layer is 15 Angstroms or less.
10. The nitride semiconductor light emitting device according to claim 8 , wherein the well layers of the active layer are formed so as to have a band gap energy emitting green light or yellow light.
11. The nitride semiconductor light emitting device according to claim 10 , wherein the thin film barrier layer is made of a material having a band gap energy larger than that of the well layers by 0.4 eV or more.
12. The nitride semiconductor light emitting device according to claim 8 , wherein the thin film barrier layer is formed at the middle of one well layer.
13. The nitride semiconductor light emitting device according to claim 8 , wherein one of the well layers is divided into three or more by forming two or more thin film barrier layers.