Methods of applying a nanocrystalline diamond film to a cutting tool

1. A method of applying a nanocrystalline diamond film to a cutting tool, the cutting tool comprising tungsten carbide and having a cutting edge with a radius of curvature of no more than about 1 μm, the method comprising:

(a) seeding a cutting surface of the cutting tool with a diamond nanopowder, the cutting surface having a reduced cobalt content; and

(b) depositing a nanocrystalline diamond film having a thickness of no more than about 1 μm onto the seeded cutting surface.

2. The method of claim 1 , further comprising chemically etching the cutting surface to provide the cutting surface having a reduced cobalt content prior to seeding.

3. The method of claim 2 , wherein the cobalt content of the cutting surface is at least 28.5 percent lower than that of the underlying tungsten carbide substrate, based on atomic percent.

4. The method of claim 3 , wherein the cobalt content of the cutting surface having a reduced cobalt content corresponds to a cobalt content achieved by dipping the cutting tool with a solution of 50% HF, HNO 3 and deionized water in a volume ratio of 1:2:2 for a period of 3 to 10 seconds.

5. The method of claim 2 , wherein the cobalt content of the cutting surface having a reduced cobalt content corresponds to a cobalt content achieved by dipping the cutting tool with a solution of 50% HF, HNO 3 and deionized water in a volume ratio of 1:2:2 for a period of 3 to 10 seconds.

6. The method of claim 1 , wherein the cutting surface is coated with a tungsten film prior to seeding.

7. The method of claim 6 , wherein the tungsten film has a thickness of about 30 to 250 nm.

8. The method of claim 1 , wherein the deposited nanocrystalline diamond film has a hydrogen-terminated surface and is free of graphitic soot.

9. The method of claim 1 , wherein depositing the nanocrystalline diamond film comprises depositing the nanocrystalline diamond film in a hot filament chemical vapor deposition apparatus.

10. The method of claim 1 , wherein seeding the cutting surface comprises sonicating the cutting surface in a solution comprising a diamond nanopowder.

11. The method of claim 1 , wherein the nanocrystalline diamond film is a continuous film.

12. A method of applying a nanocrystalline diamond film to a cutting tool, the cutting tool comprising tungsten carbide and having a cutting edge with a radius of curvature of no more than about 1 μm, the method comprising:

(a) implanting carbon ions into a cutting surface of the cutting tool to provide a carbide rich cutting surface; and

(b) depositing a nanocrystalline diamond film having a thickness of no more than about 1 μm onto the carbide-rich cutting surface.

13. The method of claim 12 , further comprising chemically etching the cutting surface to provide a cutting surface having a reduced cobalt content.

14. The method of claim 12 , wherein the deposited nanocrystalline diamond film has a hydrogen-terminated surface and is free of graphitic soot.

15. The method of claim 12 , wherein depositing the nanocrystalline diamond film comprises depositing the nanocrystalline diamond film in a hot filament chemical vapor deposition apparatus.

16. The method of claim 15 , wherein the nanocrystalline diamond film has an sp3-bonded content of at least about 95%.

17. The method of claim 12 , wherein implanting carbon ions into the cutting surface is accomplished with a bias-enhanced nucleation process.

18. The method of claim 12 , wherein the nanocrystalline diamond film is a continuous film.