Low cost liquid cooling
View Patent ↗A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes. Advantageously, the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring interrupting the cooling process applied to the cooling plate.
1. A system for cooling processor assembly, comprising:
printed circuit boards (PCB) with a plurality of heat emitting electronic components;
a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components while the housing comprises a base portion to which are transferred heat emitted by the electronic components; and
a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate;
wherein the housings include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific dedicated place defined by the guiding holes such that the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring to interrupt the cooling process applied to the cooling plate.
2. The cooling system according to claim 1 wherein the clamps are pressured screws protruding from the base portion of the housings and activated by a clamping mechanism comprising a lateral lever on the housing driving a pusher alongside the base portion acting on the pressured screws while the activation of the lever after positioning the PCB releases the screws pulled by some spring mechanism into the housing resulting by pressing the PCB together with its housing against the cooling plate alongside the base portion locking the PCB onto the cooling plate.
3. The cooling system according to claim 1 while the cooling plate being partly hollow with internal manifolds for a liquid distribution to carry out heat transferred from the base portion of the housing to the cooling plate.
4. The cooling system according to claim 1 wherein the cooling plate is constructed in a strong enough way to act as holder for the PCBs with their housings.
5. The cooling system according to claim 1 wherein the PCBs with their housings are hung in the cooling plate such that the cooling plate cools only with its bottom side.
6. The cooling system according to claim 1 wherein the base portion of the housing to be pressed against the cooling plate is covered with some thermal interface material.
7. The cooling system according to claim 1 wherein the cooling plate comprises guiding holes on both sides allowing fixing in series PCBs with their respective housing on both sides.
8. The cooling system according to claim 2 wherein the spring mechanism pulling the screws is a spring surrounding each screw.
9. The cooling system according to claim 8 wherein the pressure exerted by the base portion of the housing on the cooling plate achieved by the spring onto the screw is adaptable by adjusting the protruding height of the screws in comparison to the base portion.
10. An electronics rack with a plurality of systems for cooling processor assembly, each comprising:
printed circuit boards (PCB) with a plurality of heat emitting electronic components;
a housing for each PCBs with a heat sink covering at least partly the heat emitting electronic components while the housing comprises a base portion to which are transferred heat emitted by the electronic components; and
a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate;
wherein the housings include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific dedicated place defined by the guiding holes such that the PCB together with its housing is pressed against the cooling plate alongside the base portion when fixed onto the cooling plate allowing thermal coupling between the housing and the cooling plate and a hot plugging of the PCB onto the cooling plate without requiring to interrupt the cooling process applied to the cooling plate.
11. The electronics rack according to claim 10 wherein the clamps are pressured screws protruding from the base portion of the housings and activated by a clamping mechanism comprising a lateral lever on the housing driving a pusher alongside the base portion acting on the pressured screws while the activation of the lever after positioning the PCB releases the screws pulled by some spring mechanism into the housing resulting by pressing the PCB together with its housing against the cooling plate alongside the base portion locking the PCB onto the cooling plate.
12. The electronics rack according to claim 10 while the cooling plate being partly hollow with internal manifolds for liquid distribution to carry out heat transferred from the base portion of the housing to the cooling plate.
13. The electronic rack according to claim 10 wherein the cooling plate is constructed in a strong enough way to act as holder for the PCBs with their housings.
14. The electronic rack according to claim 10 wherein the PCBs with their housings are hung in the cooling plate such that the cooling plate cools only with its bottom side.
15. A method for cooling processor assembly comprising printed circuit boards (PCB) with a plurality of heat emitting electronic components; a housing for each PCBs with a heat sink covering at least partly the heat emitting electronic components while the housing comprises a base portion with clamps to which are transferred heat emitted by the electronic components; and a cooling plate, the method comprising:
positioning the base portion of the housings in series onto the cooling plate by inserting the respective clamps into corresponding guiding holes of the cooling plate such that by pressing the PCB together with its housing against the cooling plate alongside the base portion when fixed onto the cooling plate a thermal coupling is achieved between the housing and the cooling plate allowing a hot plugging of the PCB onto the cooling plate without requiring to interrupt the cooling process applied to the cooling plate.
16. The method according to claim 15 further comprises the step of fixing the PCB together with its housing on the cooling plate by activating some clamping mechanism via a lateral lever on the housing driving a pusher alongside the base portion acting on the clamps being pressured screws protruding from the base portion of the housings while the activation of the lever after positioning the PCB releases the screws pulled by some spring mechanism into the housing resulting by pressing the PCB together with its housing against the cooling plate alongside the base portion locking the PCB onto the cooling plate.
17. The method according to claim 15 further comprises the step of carrying out heat transferred from the base portion of the housing to the cooling plate by providing some liquid to be distributed within the cooling plate being partly hollow with manifolds.