Pad structure for liquid crystal display and method of manufacturing thereof
A liquid crystal display has a pad structure. The pad structure includes at least one pad formed on a substrate, an insulating film formed on the pad, and at least one conductive layer connected to the pad through contact holes defined through the insulating film. The insulating film covers side surfaces of the pad and a portion of the substrate adjacent to the side surfaces of the pad.
1. A method for manufacturing a pad structure on a liquid crystal display having a grinding area and a pad contact area, the method comprising the steps of:
forming gate pads on a substrate separated by a distance from a grinding area defined on the substrate;
forming a gate insulating film on the substrate and the gate pads;
forming data pads on the gate insulating film separated by a distance from the grinding area;
forming a protective film on the substrate and the data pads;
forming a transparent conductive film to be connected to the gate pads and the data pads in the pad contact area via contact holes defined in the gate insulating film and the protective film;
forming an anisotropic conductive film on the transparent conductive film to entirely cover upper and side surfaces of the transparent conductive film, wherein the anisotropic conductive film entirely covers the contact holes; and
after the step of forming the data pad, grinding portions of the gate insulating film and the protective film disposed in the grinding area to expose a portion of the substrate in the grinding area;
wherein, after the grinding step, portions of the gate insulation film and the protective film remain between the grinding area and side surfaces of the data pads.
2. The method according to claim 1 , further comprising a step of forming a tape carrier package layer after the step of forming the anisotropic conductive film.