Heat sink and electronic device using same
View Patent ↗An electronic device includes a shell, an electronic component received in the shell, and a heat sink arranged between the electronic component and the shell. The heat sink includes a first heat spreader attaching to the electronic component, a second heat spreader spaced from the first heat spreader, and a plurality of fins between the first and second heat spreaders. Each fin includes a pair of contacting portions, a pair of bending portions and a connecting portion each of which being flat. The contacting portions are respectively connected to the two heat spreaders. The bending portions respectively extend from the contacting portions towards each other. Each bending portion forms a rear end adjacent to the other bending portion. The connecting portion interconnects the rear ends of the bending portions at opposite ends thereof.
1. An electronic device, comprising:
a shell;
an electronic component received in the shell; and
a heat sink arranged between the electronic component and the shell, the heat sink comprising a first heat spreader attaching to the electronic component, a second heat spreader spaced from the first heat spreader, and a plurality of fins between the first and the second heat spreaders, each of the fins comprising a pair of contacting portions, a pair of bending portions and a connecting portion each of which is flat, the contacting portions respectively connected to the first and second heat spreaders, the bending portions respectively extending from the contacting portions towards each other, each bending portion forming a rear end adjacent to the other bending portion, the connecting portion interconnecting the rear ends of the bending portions at opposite ends thereof;
wherein the contacting portions are parallel to each other, each bending portion extends substantially perpendicularly from one corresponding contacting portion, and the connecting portion is aslant to the contacting portions and the bending portions.
2. The electronic device of claim 1 , wherein the bending portions of each fin overlap partly in a direction perpendicular to the contacting portions, and the contacting portions and the connecting portion of each fin are continuous in a direction parallel to the contacting portions.
3. The electronic device of claim 1 , wherein the second heat spreader attaches to the shell for conducting heat of the electronic component to the shell.
4. An electronic device, comprising:
a shell;
an electronic component received in the shell; and
a fin arranged between the shell and the electronic component, the fin comprising a pair of contacting portions, a pair of bending portions and a connecting portion each of which is flat, one of the contacting portions attaching to the electronic component, the other one of the contacting portions being spaced from the electronic component, the bending portions respectively extending from the contacting portions towards each other, each bending portion forming a rear end away from a corresponding contacting portion, the connecting portion interconnecting the rear ends of the bending portions at opposite ends thereof;
wherein the contacting portions are parallel to each other, the bending portions extend substantially perpendicularly from the corresponding contacting portions, and the connecting portion is non-parallel to the contacting portions and the bending portions.
5. The electronic device of claim 4 , wherein the contacting portions and the connecting portion are continuous in a direction parallel to the contacting portions.
6. The electronic device of claim 4 , wherein the contacting portions and the connecting portion overlap each other entirely in a direction parallel to the contacting portions.
7. The electronic device of claim 4 , wherein the bending portions overlap partly in a direction perpendicular to the contacting portions, and the contacting portions and the connecting portion are continuous in a direction parallel to the contacting portions.
8. The electronic device of claim 4 , wherein the other one of the contacting portions attaches to the shell for conducting heat of the electronic component to the shell.
9. A heat sink comprising at least one fin, the at least one fin comprising a connecting portion, two bending portions respectively extending from opposite sides of the connecting portion along opposite directions, and two contacting portions respectively extending from rear sides of the bending portions along opposite directions, all of the connecting portion, the bending portions and the contacting portions being flat;
wherein the bending portions are perpendicular to the contacting portions, and the connecting portion is aslant to the bending portions.
10. The heat sink of claim 9 , further comprising a heat spreader firmly connected to one of the contacting portions.
11. The heat sink of claim 10 , further comprising a second heat spreader firmly connected to the other one of the contacting portions.
12. The heat sink of claim 9 , wherein the bending portions overlap partly in a direction perpendicular to the contacting portions.
13. The heat sink of claim 9 , wherein the bending portions space from each other in a direction perpendicular to the contacting portions.
14. The heat sink of claim 13 , wherein the connecting portion and the contacting portions are continuous in a direction parallel to the contacting portions.
15. The heat sink of claim 13 , wherein the connecting portion and the contacting portions overlap entirely in a direction parallel to the contacting portions.
16. The heat sink of claim 12 , wherein the connecting portion and the contacting portions overlap entirely in a direction parallel to the contacting portions.
17. The heat sink of claim 12 , wherein the connecting portion and the contacting portions are continuous in a direction parallel to the contacting portions.