Method for manufacturing semiconductor device

1. A method for manufacturing a semiconductor device, the method comprising:

forming an underlying layer over a semiconductor substrate;

forming a hard mask layer over the underlying layer;

forming first photoresist patterns over the hard mask layer;

forming a hardening layer on the first photoresist patterns, wherein the hardening layer is formed on the first photoresist patterns by an exposure process using an ultraviolet beam or an electron beam;

forming second photoresist patterns between the first photoresist patterns, the first and second photoresist patterns being defined on substantially the same plane, wherein the first and second photoresist patterns are formed using the same mask;

etching the hard mask layer with the first and second photoresist patterns as masks to form a hard mask pattern;

etching the underlying layer with the first and second photoresist patterns and the hard mask pattern; and

removing the first and second photoresist patterns, and the hard mask pattern.

2. The method according to claim 1 , wherein the underlying layer includes an amorphous carbon layer.

3. The method according to claim 2 , wherein the amorphous carbon layer has a thickness ranging from about 1000 to 3000Å.

4. The method according to claim 1 , wherein the hard mask layer includes a silicon oxynitride film.

5. The method according to claim 4 , wherein the silicon oxynitride film has a thickness ranging from about 300 to 500Å, wherein the first and second photoresist patterns are formed directly on a bottom anti-reflective coating film that is formed over the hard mask layer.

6. The method according to claim 4 , wherein the forming-a-hard-mask-layer further includes forming a bottom anti-reflective coating film over the silicon oxynitride film.

7. The method according to claim 6 , wherein the bottom anti-reflective coating film has a thickness ranging from about 200 to 400Å.

8. The method according to claim 1 , wherein the first photoresist pattern includes a positive photoresist film.

9. The method according to claim 1 , wherein the first photoresist pattern has a thickness ranging from about 1400 to 1600Å.

10. The method according to claim 1 , wherein the second photoresist pattern is formed of a positive photoresist.

11. The method according to claim 1 , wherein the second photoresist pattern has a thickness ranging from about 1400 to 1600Å.

12. A method for manufacturing a semiconductor device, the method comprising:

forming an underlying layer over a semiconductor substrate;

forming a hard mask layer over the underlying layer;

forming first etch patterns over the hard mask layer, wherein the first etch patterns comprise photoresist material;

forming a hardening layer over the first etch patterns, wherein the hardening layer is formed on the first etch patterns by an exposure process using an ultraviolet beam or an electron beam;

forming second etch patterns between the first etch patterns, wherein the second etch patterns are formed after the hardening layer is formed, the second etch patterns comprising photoresist material, wherein the first and second etch patterns are formed by using the same mask;

etching the hard mask layer using the first and second etch patterns as an etch mask to form a hard mask pattern; and

etching the underlying layer using at least the hard mask pattern,

wherein the first and second etch patterns are formed substantially on the same layer.

13. The method of claim 12 , further comprising:

forming an bottom anti-reflective coating film over the hard mask layer,

wherein the first and second etch patterns are formed directly on the bottom anti-reflective coating film, and

wherein each first pattern is provided between the two adjacent second patterns.