Subwavelength resolution optical microscopy
Provided herein are methods for imaging subwavelength structures in three dimensions and with high resolution. The methods comprise illuminating subwavelength structures with an illuminating wavelength of light and detecting the self-image generated thereby at a distance distal to the structures. Also provided is a method for confining propagating light to a sub-diffraction limit dimension by illuminating a surface of a metal structure with subwavelength features with a wavelength of coherent light such that light propagating from the features is confined to a dimension that is a sub-diffraction limit thereof.
1. A method for three-dimensional imaging of subwavelength structures with high resolution, comprising:
illuminating a metal structure having features with dimensions that are a subwavelength of an illuminating incident light wavelength to generate a self-image thereof; and
detecting the Talbot self-image with a photodetector at a distance distal to the metal structure thereby producing a three-dimensional high resolution image; wherein the subwavelength features on the structures by a mapping spatial intensity distribution of light transmitted through the metal structures at distances from the metal surface and the self-image is the map of the intensity distribution of the light at various distances to be imaged from the metal structures.
2. The method of claim 1 , wherein the illuminating step comprises transmitting the incident light from a far-field source.
3. The method of claim 1 , wherein the metal structure has periodic subwavelength sized features or periodic features greater than subwavelength size.
4. The method of claim 1 , wherein the metal structure is a metal film.
5. The method of claim 1 , wherein the metal structure is gold, silver, aluminum, cooper, nickel, tungsten, platinum, palladium, or chromium or a metal alloy.
6. The method of claim 1 , wherein the distance distal to the metal structure is about 1 nanometer to about 1000 microns.
7. The method of claim 6 , wherein the distance distal to the metal structure about 1 nm to about 500 nm, about 500 nm to 1000 microns, about 1 micron to about 1000 microns, or about 450 microns to about 1000 microns.
8. The method of claim 1 , wherein the self-image comprises subwavelength size optical spots or transmitted light having an intensity modulation along a propagation axis or in planes above the structure.
9. A method for imaging an object of interest comprising:
applying the object of interest to a metal structure, said object having dimensions that are a subwavelength of a wavelength of incident illuminating light;
illuminating the metal structure with the incident light to generate a self-image thereof; and
detecting the Talbot self-image with a photodetector at a distance distal to the metal structure thereby imaging the object of interest; wherein the subwavelength features on the structures by a mapping spatial intensity distribution of light transmitted through the metal structures at distances from the metal surface and the self-image is the map of the intensity distribution of the light at various distances to be imaged form the metal structures.
10. The method of claim 9 , wherein the illuminating step comprises transmitting the incident light from a far-field source.
11. The method of claim 9 , wherein the detecting step comprises scanning the object of interest for optical spots that comprise the self-image.
12. The method of claim 9 , wherein the object of interest is an organelle, cell, tissue, organism, nucleic acid, protein, antibody, lipid, integrated circuit, or semiconductor wafer.
13. The method of claim 9 , wherein the metal structure comprises subwavelength features.
14. The method of claim 9 , wherein the metal structure has periodic features.
15. The method of claim 9 , wherein the metal structure is a film.
16. The method of claim 9 , wherein the metal structure is gold, silver, aluminum, cooper, nickel, tungsten, platinum, palladium, or chromium, or is a metal alloy.
17. The method of claim 9 , wherein the distance distal to the metal structure is about 1 nanometer to about 1000 microns.
18. The method of claim 17 , wherein the distance distal to the metal structure is about 1 nm to about 500 nm, about 500 nm to 1000 microns, about 1 micron to about 1000 microns, or about 450 microns to about 1000 microns.
19. The method of claim 9 , wherein the self-image comprises subwavelength size optical spots or transmitted light having an intensity modulation along a propagation axis or in planes above the structure.