Photosensitive resin composition comprising a halogen-free colorant
The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R, is hydrogen or C 1 ,-C 4 .-Alkyl, R 2 is hydrogen or C 1 ,-C 4 -Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C 1 ,-C 6 alkyl, C 1 ,-C 6 alkoxy, hydroxy, NHCOR 3 , NHSO 2 , R 4 or SO 2 NHR 5 , wherein R 3 , is C 1 ,-C 4 ,-Alkyl or phenyl, R 4 , is C 1 ,-C 4 -Alkyl or phenyl and R 5 is C 1 ,-C 4 -Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards.
1. A photosensitive resin composition comprising as a component (A) a halogen-free green colorant of the formula
in which the rings A, B, C and D are substituted by the moiety
wherein R 1 is hydrogen or C 1 -C 4 -Alkyl, R 2 is hydrogen or C 1 -C 4 -Alkyl,
n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C 1 -C 6 alkyl, C 1 -C 6 alkoxy, hydroxy, NHCOR 3 , NHSO 2 R 4 or SO 2 NHR 5 , wherein R 3 is C 1 -C 4 -Alkyl or phenyl, R 4 is C 1 -C 4 -Alkyl or phenyl and R 5 is C 1 -C 4 -Alkyl or phenyl,
b) as a component (B) an alkali soluble reactive or unreactive oligomer or reactive or unreactive polymer,
c) as a component (C) a polymerizable monomer,
d) as a component (D) a photoinitiator,
e) as a component (E) an epoxy compound, and also, if desired,
f) as a component (F) further additives.
2. A photosensitive resin composition according to claim 1 , wherein the component (A) is the colorant of formula
3. Substrate coated with the photosensitive resin composition according to claim 2 .
4. Substrate coated with the photosensitive resin composition according to claim 1 .
5. A photosensitive resin according to claim 1 , wherein the polymerizable monomer is a vinyl monomer.