Image sensor and method having an anti-reflection stack with films of different refractive indexes
An image sensor pixel that includes a photoelectric conversion unit supported by a substrate and an insulator adjacent to the substrate. The pixel includes a light guide that is located within an opening of the insulator and extends above the insulator such that a portion of the light guide has an air interface. The air interface improves the internal reflection of the light guide. Additionally, the light guide and an adjacent color filter are constructed with a process that optimizes the upper aperture of the light guide. These characteristics of the light guide eliminate the need for a microlens.
1. An image sensor, comprising:
a substrate;
a photoelectric conversion unit in said substrate;
a light guide, said light guide having a light-guide refractive index; and,
an anti-reflection stack under said light guide and on said substrate, said anti-reflection stack disposed to transmit a light from said light guide to said photoelectric conversion unit, consisting essentially of:
a third film on said substrate, said third film having a third refractive index lower than said light-guide refractive index;
a second film on said third film, said second film having a second refractive index higher than said third refractive index; and
a top film on said second film, said top film having a first refractive index lower than said light-guide refractive index and said second refractive index.
2. The image sensor of claim 1 , wherein said top film comprises silicon oxide and has a thickness within a range of 800 Angstroms±10%.
3. The image sensor of claim 1 , wherein said second film comprises silicon nitride.
4. The image sensor of claim 1 , wherein said third film comprises silicon oxide and has a thickness within a range of 75 Angstroms±10%.
5. The image sensor of claim 1 , wherein said light guide comprises silicon nitride.
6. An image sensor, comprising:
a substrate;
a photoelectric conversion unit in said substrate;
a light guide, said light guide having a light-guide refractive index;
a light-guide etch-stop film under said light guide; and,
an anti-reflection stack under said light-guide etch-stop film and on said substrate, said anti-reflection stack disposed to transmit a light from said light guide to said photoelectric conversion unit, consisting essentially of:
a third film on said substrate, said third film having a third refractive index lower than said light-guide refractive index;
a second film on said third film, said second film having a second refractive index higher than said third refractive index; and
a top film on said second film, said top film having a first refractive index lower than said light-guide refractive index and said second refractive index.
7. The image sensor of claim 6 , wherein said top film comprises silicon oxide and has a thickness within a range of 800 Angstroms±10%.
8. The image sensor of claim 6 , wherein said second film is also a contact etch stop film.
9. The image sensor of claim 6 , wherein said third film comprises silicon oxide and has a thickness within a range of 75 Angstroms±10%.
10. A method for forming an image sensor, comprising:
providing a substrate;
forming a photoelectric conversion unit in said substrate;
forming a third film on said substrate and over said photoelectric conversion unit, said third film having a third refractive index;
forming a second film on said third film, said second film having a second refractive index higher than said third refractive index;
forming a top film on said second film, said top film having a first refractive index lower than said second refractive index; and,
forming a light guide on said top film, said light guide comprising a light guide material having a light guide refractive index higher than said first and third refractive indices.
11. The method of claim 10 , wherein said second film comprises silicon nitride.
12. The method of claim 10 , wherein said second film has a thickness within a range of 500 Angstroms±10%.
13. The method of claim 10 , wherein said second film has a thickness between 300 Angstroms and 900 Angstroms.
14. The method of claim 10 , wherein said second film is also a contact etch-stop film.
15. The method of claim 10 , wherein said top film has a thickness between 750 Angstroms and 2000 Angstroms.
16. The method of claim 15 , wherein said top film comprises a silicon oxide.
17. The method of claim 15 , wherein said top film comprises a silicon oxynitride.
18. The method of claim 10 , wherein said third film comprises a silicon oxide or a silicon oxynitride.
19. The method of claim 10 , wherein a transmission coefficient of light from the light guide to the substrate across the top, second and third films peaks below 490 nm of wavelength-of-light-in-air.
20. The method of claim 10 , further comprising:
forming an insulating film on the second film; and,
forming an opening in the insulating film to expose the second film, after which the top film is formed in the opening.
21. A method for forming an image sensor, comprising:
providing a substrate;
forming a photoelectric conversion unit in said substrate;
forming a third film on said substrate and over said photoelectric conversion unit, said third film having a third refractive index;
forming a second film on said third film, said second film having a second refractive index higher than said third refractive index;
forming a top film on said second film, said top film having a first refractive index lower than said second refractive index;
forming a light-guide etch-stop film on said top film; and,
forming a light guide on said light-guide etch-stop film, said light guide comprising a light guide material having a light guide refractive index higher than said first and third refractive indices.
22. The method of claim 21 , wherein said second film comprises a silicon nitride.
23. The method of claim 21 , wherein said second film has a thickness between 300 Angstroms and 900 Angstroms.
24. The method of claim 21 , wherein said second film is also a contact etch-stop
25. The method of claim 21 , wherein said top film has a thickness between 750 Angstroms and 2000 Angstroms.
26. The method of claim 25 , wherein said top film comprises a silicon oxide.
27. The method of claim 25 , wherein said top film comprises a silicon oxynitride.
28. The method of claim 21 , wherein said third film comprises a silicon oxide or a silicon oxynitride.
29. The method of claim 21 , wherein a transmission coefficient of light from the light guide to the substrate across the top, second and third films peaks below 490 nm of wavelength-of-light-in-air.
30. The method of claim 21 , wherein a transmission coefficient of light from the light guide to the substrate across the top, second and third films has a trough between 500 nm and 600 nm of wavelength-of-light-in-air.
31. The method of claim 21 , further comprising:
etching back at least one of the top and second films.
32. The image sensor of claim 1 , wherein a transmission coefficient of light from the light guide to the substrate across the top, second and third films peaks below 490 nm of wavelength-of-light-in-air.
33. The image sensor of claim 6 , wherein a transmission coefficient of light from the light guide to the substrate across the top, second and third films peaks below 490 nm of wavelength-of-light-in-air.
34. The image sensor of claim 6 , wherein said light-guide etch-stop film comprises a silicon nitride.
35. The image sensor of claim 1 , wherein said top film has a thickness between 750 Angstroms and 2000 Angstroms.
36. The image sensor of claim 35 , wherein said top film comprises a silicon oxide.
37. The image sensor of claim 35 , wherein said top film comprises a silicon oxynitride.
38. The image sensor of claim 6 , wherein said top film has a thickness between 750 Angstroms and 2000 Angstroms.
39. The image sensor of claim 38 , wherein said top film comprises a silicon oxide.
40. The image sensor of claim 38 , wherein said top film comprises a silicon oxynitride.
41. The image sensor of claim 6 , further comprising:
another anti-reflection stack below another light guide that shares the light-guide refractive index, said other anti-reflection stack disposed to transmit another light from said other light guide to another photoelectric conversion unit in said substrate, said other anti-reflection stack consisting essentially of:
another third film on said substrate, said other third film has same thickness, composition and refractive index as said third film;
another second film on said other third film, said other second film has same composition and refractive index as said second film; and,
another top film on said other second film, said other top film has same composition and refractive index as said top film,
wherein either said other top film has a lesser thickness than said top film and said other second film has same thickness as said second film or said other second film has a lesser thickness than said second film and said other top film has same thickness as said top film.
42. The image sensor of claim 41 , wherein, between said anti-reflection stack and said other anti-reflection stack, one has a peak of transmission coefficient of light below 500 nm of wavelength-of-light-in-air whereas the other has a peak of transmission coefficient of light above 500 nm of wavelength-of-light-in-air.
43. The image sensor of claim 41 , wherein, between said anti-reflection stack and said other anti-reflection stack, one is at a green pixel whereas the other is at a blue pixel.