Circuit board with identifiable information and method for fabricating the same

1. A method for fabricating a circuit board with identifiable information, comprising the steps of:

preparing a core board having a patterned circuit layer formed a surface thereof;

providing an insulating layer on the surface of the core board;

forming a plurality of first openings and second openings in the insulating layer, wherein the first openings are disposed on a part of the circuit layer, and the second openings are located at a non-circuit area of the insulating layer free of a circuit layout without penetrating the insulating layer;

performing a build up process to form a conductive circuit layer on the insulating layer, a plurality of conductive vias in the first openings, and metal identifiable information in the second openings, wherein the metal identifiable information is formed by electroplating and not electrically conductive to the conductive circuit layer; and

forming a patterned insulating protection layer on an outer circuit layer of the circuit board.

2. The method of claim 1 , wherein the first openings and the second openings are formed by laser drilling technology.

3. The method of claim 1 , wherein the metal identifiable information in the second openings is one selected from the group consisting of numbers, letters, and bar codes.

4. The method of claim 1 , wherein the metal identifiable information is formed in an insulating layer intended to be formed with a circuit layer within the circuit board.

5. The method of claim 1 , wherein the metal identifiable information is recognizable using X-ray.

6. The method of claim 1 , wherein the metal identifiable information is located in the same layer as an outer circuit layer of the circuit board.

7. The method of claim 1 , wherein the metal identifiable information is readable through eyes, a microscope or a bar code reader.

8. A method for fabricating a circuit board with identifiable information, comprising the steps of:

preparing a core board having at least one internal insulating layer with a non-circuit area free of a circuit layout;

forming a plurality of openings in the non-circuit area of the insulating layer without penetrating the insulating layer;

forming a patterned circuit layer on a surface of the insulating layer;

forming metal identifiable information in the openings of the non-circuit area, wherein the metal identifiable information is formed by electroplating and not electrically conductive to the conductive circuit layer; and

forming a patterned insulating protection layer on an outer circuit layer of the circuit board.

9. The method of claim 8 , wherein the metal identifiable information in the openings is one selected from the group consisting of numbers, letters, and bar codes.

10. The method of claim 8 , wherein the metal identifiable information is formed in an insulating layer intended to be formed with a circuit layer within the circuit board.

11. The method of claim 8 , wherein the metal identifiable information is recognizable using X-ray.

12. The method of claim 8 , wherein the metal identifiable information is formed in the same layer with an outer circuit layer of the circuit board.

13. The method of claim 8 , wherein the metal identifiable information is readable through eyes, a microscope or a bar code reader.

14. The method of claim 1 , further comprising providing an insulating layer on the surface of the circuit board and performing the circuit build up process to form another conductive circuit layer on the circuit board before forming the patterned insulating protection layer.

15. The method of claim 11 , further comprising providing an insulating layer on the surface of the circuit board and performing the circuit build up process to form another conductive circuit layer on the circuit board before forming the patterned insulating protection layer.