Curable adhesive compositions, process, and applications
The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.
1. A composition comprising:
a protected phenolic compound, where the protected phenolic compound comprises at least three aryl glycidyl carbonate moieties;
an epoxy resin; and
a microencapsulated deblocking agent.
2. The composition of claim 1 , where the protected phenolic compound is selected from the list including the following aryl glycidyl carbonates:
wherein n is at least 3.
3. The composition of claim 1 , where the epoxy resin is derived from at least one of bisphenol A, bisphenol F, novolac, polyphenol, aniline, polyaniline, or their oligomeric or halogenated derivatives.
4. The composition of claim 1 , comprising:
0.1 to 90 percent by weight of the protected phenolic compound; and
10 to 99.9 percent by weight of the epoxy resin.
5. The composition of claim 4 , comprising 0.1 to 90 percent by weight of the deblocking agent.
6. The composition of claim 5 , where the deblocking agent is an amine, imidazole, triazine, triazole or an imidazole-epoxy adduct.
7. The composition of claim 1 , where the microencapsulated deblocking agent is encapsulated within a polymer shell.
8. The composition of claim 1 , where the microencapsulated deblocking agent is encapsulated in a polymeric matrix.
9. The composition of claim 1 , further comprising one or more elements selected from:
curing agents and catalysts for epoxides, fillers, surfactants, coupling agents, pigments, dyes, and conducting particles.
10. A composition comprising: 0.1 to 90 percent by weight of a protected phenolic compound comprising at least three aryl glycidyl carbonate moieties selected from the following:
wherein n is at least 3
10 to 99.9 percent by weight of an epoxy resin derived from at least one of bisphenol A, bisphenol F, novolac, polyphenol, aniline, polyaniline, or their oligomeric or halogenated derivatives; and 0.1 to 90 percent by weight of a deblocking agent comprising an amine, imidazole, triazine, triazole or an imidazole-epoxy adduct, the deblocking agent being microencapsulated in a polymeric matrix.
11. The composition of claim 10 , further comprising 0.1 to 90 weight percent benzoxazine selected from the list including the following benzoxazine compounds:
12. The composition of claim 11 , where the composition is an adhesive, conducting adhesive, composite, molding compound, anisotropic conducting film (ACF) adhesive, non-random array ACF, non-conductive adhesive film (NCF), coating, encapsulant, underfill material, lead or free solder.
13. The composition of claim 11 , where the composition is a 1-part adhesive composition having a substantially long shelf-life at storage conditions, and the composition is reactive at either the curing temperature or the molding temperature.