Manufacturing process for surge arrester module using pre-impregnated composite
An electrical module assembly used in a surge arrester is manufactured by wrapping an electrical module assembly including at least one metal oxide varistor (MOV) disk to which a reinforcing structure including a pre-impregnated epoxy/glass-fiber composite has been applied with shrink film and compacting the wrapped electrical module assembly by heating the shrink film such that the shrink film shrinks and applies a radially compressive force to the electrical module assembly. The wrapped electrical module assembly then is cured at a temperature at which the shrink film no longer applies a compressive force.
1. An apparatus comprising:
a disk assembly including at least a first MOV disk defining a first surface and a second MOV disk defining a second surface, the first surface in direct contact with the second surface;
a reinforcing structure applied to at least a portion of one of the first MOV disk and the second MOV disk; and
a removable film applied to the disk assembly and the reinforcing structure, the film being configured to compress the disk assembly.
2. The apparatus of claim 1 , wherein the film being configured to compress the assembly comprises the film being configured to shrink in response to being heated to a first temperature.
3. The apparatus of claim 2 , wherein the first temperature is a temperature below a melting temperature of the film.
4. The apparatus of claim 2 , wherein the reinforcing structure includes a material that is viscous at the first temperature.
5. The apparatus of claim 1 , wherein tension applied to the film compresses the disk assembly.
6. The apparatus of claim 5 , wherein the film comprises a tape that does not shrink when heated.
7. The apparatus of claim 6 , wherein the tape is attached to the disk assembly at an end of the disk assembly.
8. The apparatus of claim 5 , wherein the film is spiral wound around the disk assembly.
9. The apparatus of claim 2 , wherein the reinforcing structure includes a material that is viscous at the first temperature and the viscosity is such that the material does not flow between the first and second MOV disks.
10. The apparatus of claim 1 , wherein the film is further configured to compress the reinforcing structure.
11. The apparatus of claim 10 , wherein at least a portion of the reinforcing structure is between the film and one of the first and the second MOV disks.
12. The apparatus of claim 1 , wherein the film is applied to the entire disk assembly.
13. The apparatus of claim 1 , further comprising a terminal configured to electrically connect the assembly to an external device.
14. The apparatus of claim 1 , wherein the reinforcing structure comprises a fiber matrix.
15. The apparatus of claim 14 , wherein the fiber matrix is impregnated with epoxy and the fiber matrix includes a plurality of individual fibers that have an predetermined pattern relative to each other.
16. The apparatus of claim 1 , wherein an interface is formed between the first surface and the second surface.
17. An apparatus comprising:
a disk assembly including at least a first MOV disk and a second MOV disk;
a reinforcing structure applied to at least a portion of one of the first MOV disk and the second MOV disk; and
a film applied to the disk assembly and the reinforcing structure, the film being configured to compress the disk assembly such that a portion of the first MOV disk and a portion of the second MOV disk are coupled directly together along an axial direction.
18. The apparatus of claim 17 , wherein the first MOV disk and the second MOV disk are directly coupled together without an intervening material.
19. The apparatus of claim 17 , wherein the reinforcing structure comprises a fiber matrix comprising epoxy.
20. The apparatus of claim 1 , wherein the film is applied to substantially the entire disk assembly.
21. The apparatus of claim 1 , wherein the film is configured to circumferentially compress the disk assembly.
22. An apparatus comprising:
a disk assembly including at least a first MOV disk defining a first surface and a second MOV disk defining a second surface, the first surface in direct contact with the second surface;
a reinforcing structure applied to at least a portion of one of the first MOV disk and the second MOV disk; and
a film applied to the disk assembly and the reinforcing structure, the film being configured to compress the disk assembly, wherein the film being configured to compress the assembly comprises the film being configured to shrink in response to being heated to a first temperature.