Analysis method for semiconductor device
An analysis method for a semiconductor device is described. The semiconductor device having an abnormal region is provided. Thereafter, a focused ion beam microscope analysis process is performed to the abnormal region, wherein the result of the focused ion beam microscope analysis process shows that the abnormal region has a defect therein. After the focused ion beam microscope analysis process, an electrical property measurement step is performed to the abnormal region, so as to determine whether the defect in the abnormal region is a device failure root cause or not.
1. An analysis method for a semiconductor device, comprising:
providing the semiconductor device having an abnormal region;
performing a focused ion beam (FIB) microscope analysis process to the abnormal region, wherein a result of the FIB analysis process shows that the abnormal region has a defect therein; and
performing an electrical property measurement step to the abnormal region after the FIB microscope analysis process, so as to determine whether the defect in the abnormal region is a device failure root cause or not.
2. The analysis method of claim 1 , further comprising performing an optional transmitting electron microscope (TEM) analysis process after the electrical property measurement step.
3. The analysis method of claim 1 , wherein the electrical property measurement step comprises a nano-probing measurement process or a conductive atomic force microscope (C-AFM) measurement process.
4. The analysis method of claim 3 , wherein the nano-probing measurement process or the C-AFM measurement process further comprises generating a current-voltage curve, so as to determine whether the defect in the abnormal region is the device failure root cause or not.
5. The analysis method of claim 1 , wherein the FIB microscope analysis process comprises using a focused ion beam to cut the semiconductor device down to the abnormal region, so as to form an opening in the abnormal region.
6. The analysis method of claim 5 , wherein the step of using the focused ion beam to cut the semiconductor device down to the abnormal region comprises using an ion beam to cut the semiconductor device down to the abnormal region and using an electron beam to perform a monitor process.
7. The analysis method of claim 5 , further comprising forming a protection layer on a surface of the semiconductor device before the step of using the focused ion beam to cut the semiconductor device down to the abnormal region.
8. The analysis method of claim 5 , wherein the semiconductor device has a metal-oxide semiconductor device layer and an interconnection layer on the metal-oxide semiconductor device layer.
9. The analysis method of claim 8 , further, before performing the electrical property measurement step, comprising:
filling a coating layer in the opening; and
performing a polishing process until the interconnection layer is exposed.
10. The analysis method of claim 8 , wherein the abnormal region is located in the metal-oxide semiconductor device layer or the interconnection layer.
11. An analysis method of a semiconductor device, comprising:
providing the semiconductor device having an abnormal region;
performing a focused ion beam (FIB) microscope analysis process to the abnormal region, wherein a result of the FIB microscope analysis process shows that the abnormal region has a first defect therein;
performing an electrical property measurement step to the abnormal region after the FIB microscope analysis process, wherein a result of the electrical property measurement step shows that the first defect is not a device failure root cause; and
performing the FIB microscope analysis process to the abnormal region again after the electrical property measurement step, wherein a result of the FIB microscope analysis process shows that the abnormal region has a second defect, and the second defect is the device failure root cause.
12. The analysis method of claim 11 , wherein the electrical property measurement step comprises a nano-probing measurement process or a conductive atomic force microscope (C-AFM) measurement process.
13. The analysis method of claim 12 , wherein the nano-probing measurement process or the C-AFM measurement process further comprises generating a current-voltage curve, the current-voltage curve of the electrical property measurement step showing that the first defect is not the device failure root cause.
14. The analysis method of claim 11 , wherein the FIB microscope analysis process comprises using a focused ion beam to cut the semiconductor device down to the abnormal region, so as to form an opening in the abnormal region.
15. The analysis method of claim 14 , wherein the step of using the focused ion beam to cut the semiconductor device down to the abnormal region comprises using an ion beam to cut the semiconductor device down to the abnormal region and using an electron beam to perform a monitor process.
16. The analysis method of claim 14 , further comprising forming a protection layer on a surface of the semiconductor device before the step of using the focused ion beam to cut the semiconductor device down to the abnormal region.
17. The analysis method of claim 14 , wherein the semiconductor device has a metal-oxide semiconductor device layer and an interconnection layer on the metal-oxide semiconductor device layer.
18. The analysis method of claim 17 , further, before performing the electrical property measurement step, comprising:
filling a coating layer in the opening; and
performing a polishing process until the interconnection layer is exposed.
19. The analysis method of claim 17 , wherein the abnormal region is located in the metal-oxide semiconductor device layer or the interconnection layer.